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Summary
Summary
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
YOUR STEP-BY-STEP GUIDE THROUGH THE ENTIRE ELECTRONIC ASSEMBLY FABRICATION PROCESS
Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill.
Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial. Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into:
* Chips
* Boards
* Solders
* Packages
* Interconnections
* Substrates
* Deposition
* Cleaning
* Coating
* The latest environmental rules and constraints
ELECTRONIC ASSEMBLY FABRICATION will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.
Author Notes
CHARLES A. HARPER is the President of Technology Seminars, Inc., an organization which provides educational training courses in electronic packaging and manufacturing to business and industry. He also had an earlier esteemed career with Westinghouse in this field. Widely recognized as one of the leaders in this industry, he has authored over a dozen highly respected books and is among the founders and past presidents of the International Microelectronics and Packaging Society (IMAPS). He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series, a widely used book series in the electronics industry. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he has also served as Adjunct Professor.
Table of Contents
| Preface |
| Contributors |
| Dedication |
| Chapter 1 Printed Circuit History and Overview |
| Chapter 2 Development and Fabrication of IC Chips |
| Chapter 3 Packaging of IC Chips |
| Chapter 4 Laminates and Prepregs as Circuit Board Base Materials |
| Chapter 5 Printed Circuit Board Fabrication |
| Chapter 6 Package and Component Attachment and Interconnection |
| Chapter 7 Solder Materials and Processes for Electronic Assembly Fabrication |
| Chapter 8 Printed Wiring Board Cleaning |
| Chapter 9 Board Coating Materials and Processes |
| Chapter 10 Flexible and Rigid Flexible Fabrication |
| Chapter 11 Fabrication and Properties of Electronic Ceramics and Composites |
| Chapter 12 Hybrid Microelectronics and Multichip Module Technologies |
| Chapter 13 Environmental Considerations in Electronic Assembly Fabrication |
| Index |
| About the Editor |
