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Cover image for Advanced materials for thermal management of electronic packaging
Title:
Advanced materials for thermal management of electronic packaging
Personal Author:
Series:
Springer series in advanced microelectronics, 30

Springer series in advanced microelectronics ; 30
Publication Information:
New York ; London : Springer, c2011.
Physical Description:
xxi, 616 p. : ill. (some col.) ; 25 cm.
ISBN:
9781441977588

9781441977595

Available:*

Library
Item Barcode
Call Number
Material Type
Item Category 1
Status
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30000010273859 TK7870.15 T56 2011 Open Access Book Book
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