Title:
Portable electronics product design & development : for cellular phones, PDAs, digital cameras, personal electronics and more
Personal Author:
Series:
McGraw-Hill professional engineering
Publication Information:
New York : McGraw-Hill 2004
ISBN:
9780071416399
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000010046559 | TK7836 H37 2004 | Open Access Book | Book | Searching... |
Searching... | 30000010095830 | TK7836 H37 2004 | Open Access Book | Book | Searching... |
On Order
Summary
Summary
Ulrich and McGrath are both McGraw-Hill titles and both carry stunning Amazon rankings. Ulrich is an engineering text, while McGrath is more of a conversational introduction to the field (with a strong focus on microelectronics products) without all the engineering detail. The Kunkel book is a tech coffee table item that focuses primarily on visual design, while Williams covers only the limited EMC prevention side of product design. The success of our other titles indicates the strength of the market - and there are still very few books serving it.
Table of Contents
Preface | p. ix |
Chapter 1. The Portable Electronic Design Process | p. 1 |
1.1 The Product Development Process | p. 1 |
1.1.1 Product planning | p. 2 |
1.1.2 Design & engineering | p. 2 |
1.1.3 Procurement | p. 3 |
1.1.4 Manufacturing | p. 4 |
1.1.5 Marketing and distribution | p. 4 |
1.1.6 Service and support | p. 5 |
1.2 Portable Electronic Design Factors | p. 6 |
1.2.1 Functionality | p. 6 |
1.2.2 Performance | p. 9 |
1.2.3 User interface | p. 13 |
1.2.4 Form-factor | p. 14 |
1.2.5 Battery life | p. 25 |
1.2.6 Cost | p. 26 |
1.2.7 Time to market (TTM) | p. 27 |
1.2.8 Reliability | p. 28 |
1.3 System Design | p. 30 |
1.3.1 Product concept | p. 30 |
1.3.2 Innovation | p. 31 |
1.3.3 Creation | p. 35 |
1.3.4 Validation | p. 37 |
1.3.5 Communication | p. 39 |
1.3.6 Product requirements | p. 39 |
1.3.7 System architecture development | p. 49 |
1.3.8 Trade-off analysis | p. 51 |
1.3.9 Cost modeling discussion | p. 55 |
1.3.10 Circuit design | p. 58 |
1.3.11 Physical and mechanical design | p. 60 |
Chapter 2. Digital and Analog Processing | p. 65 |
2.1 Microprocessor | p. 66 |
2.2 Logic Devices | p. 69 |
2.3 Microcontroller | p. 70 |
2.4 DSP | p. 71 |
2.5 Analog Devices | p. 71 |
2.6 Sensors | p. 72 |
2.7 Wireless Communications | p. 74 |
2.8 System Memory | p. 76 |
2.9 Mass Storage | p. 77 |
Chapter 3. Electronic Packaging | p. 81 |
3.1 IC Packaging | p. 87 |
3.1.1 Leaded package | p. 89 |
3.1.2 TAB/TCP package | p. 90 |
3.1.3 COB | p. 90 |
3.1.4 Flip-chip | p. 91 |
3.1.5 BGA | p. 94 |
3.1.6 CSP | p. 96 |
3.2 Discrete Components | p. 98 |
3.3 Board-to-Board Connectors | p. 100 |
3.4 Substrates | p. 104 |
3.5 Escape Routing | p. 108 |
3.6 PCA/Module Design Metrics | p. 114 |
3.7 Electronic Packaging Metrics | p. 114 |
3.8 I/O Hardware | p. 118 |
3.8.1 Buttons, switches, dials, and touch screens | p. 118 |
3.8.2 Speakers and microphones | p. 121 |
3.8.3 Antennas | p. 121 |
3.8.4 External connectors | p. 121 |
Chapter 4. Displays | p. 123 |
4.1 Display Technology Overview | p. 127 |
4.2 LCD | p. 128 |
4.3 Other Display Technologies | p. 135 |
4.4 Microdisplays | p. 135 |
4.5 Pen Input | p. 138 |
4.6 Definition of Key Terms | p. 139 |
Chapter 5. Power Sources | p. 145 |
5.1 Battery Technologies | p. 146 |
5.1.1 Ni-Cd | p. 146 |
5.1.2 Alkaline | p. 146 |
5.1.3 Ni-MH | p. 146 |
5.1.4 Lithium ion | p. 146 |
5.1.5 Lithium polymer | p. 147 |
5.1.6 Photovoltaic cells | p. 147 |
5.1.7 Fuel cells | p. 147 |
5.2 Product Implementation | p. 148 |
5.3 High Level Power Analysis | p. 162 |
Chapter 6. Mechanical Design | p. 165 |
6.1 Housings | p. 165 |
6.2 EMI Shielding | p. 168 |
6.3 Thermal Management | p. 175 |
6.3.1 High-level thermal analysis | p. 177 |
6.3.2 Thermal issues in notebook computers | p. 179 |
6.4 Mechanical Integration | p. 183 |
6.4.1 Wristwatch example | p. 183 |
6.5 DFMA Analysis | p. 190 |
Chapter 7. Software and Communications | p. 193 |
7.1 Software Hierarchy | p. 193 |
7.1.1 Hardware platform | p. 194 |
7.1.2 Hardware abstraction layer (HAL) | p. 194 |
7.1.3 Kernel | p. 194 |
7.1.4 BIOS | p. 194 |
7.1.5 Device drivers | p. 195 |
7.1.6 OS/RTOS | p. 195 |
7.1.7 API | p. 195 |
7.1.8 Application | p. 195 |
7.2 OSI Network Communications Model | p. 195 |
7.3 Communications and System I/O | p. 197 |
7.4 Wireless Standards | p. 200 |
Chapter 8. Cellular Phones | p. 203 |
Chapter 9. Portable PCs | p. 225 |
Chapter 10. Personal Digital Assistants | p. 265 |
Chapter 11. Digital Imaging Products | p. 303 |
Chapter 12. Economics | p. 325 |
12.1 High-Volume Manufacturing and Learning Curves | p. 326 |
12.2 Leveraging Product Platforms | p. 334 |
Chapter 13. The Past, Present, and Future of Portable Electronics | p. 339 |
13.1 A Brief History of Portable Electronics | p. 339 |
13.2 Cardinal Functions | p. 344 |
13.3 Powerful Thin Clients | p. 347 |
13.4 Concluding Comments | p. 356 |
A List of Acronyms and Abbreviations | p. 359 |
References | p. 367 |
Index | p. 369 |