Title:
Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish
Personal Author:
Publication Information:
2011
Physical Description:
xiv, 84 p. : ill. ; 30 cm.
General Note:
Also available in CD ROM : CP 055289 ra
Supervisor : Prof. Dr. Ali Ourdjini
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000006070 | XX(774963.1) | Closed Access Thesis | UTM Project Paper (Open Shelves) | Searching... |
Searching... | 30000010271084 | TN760 N48 2011 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
