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Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
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Searching... | 30000004823864 | TK7868.P7 J83 1999 | Open Access Book | Book | Searching... |
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Summary
Summary
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly.
Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.
Author Notes
Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology.
Table of Contents
Foreword | p. vii |
Preface | p. ix |
Acknowledgements | p. xiii |
1 Soldering process | p. 1 |
Time on its side | p. 2 |
Printed circuit board | p. 5 |
Soldering | p. 8 |
Soldering processes | p. 16 |
Component/solder (CS) processes | p. 18 |
Solder/component (SC) processes | p. 19 |
Cleaning | p. 21 |
Quality | p. 21 |
Safety | p. 22 |
2 Electronics assemblies | p. 23 |
Joints | p. 23 |
Through-hole joints | p. 27 |
Surface mounted components | p. 35 |
Surface mounted joints | p. 36 |
Assembly variations | p. 43 |
Assembly classification | p. 49 |
3 Solder | p. 51 |
Metallurgical properties of tin/lead alloys | p. 51 |
The soldered joint | p. 56 |
Solderability | p. 66 |
Protective coatings | p. 72 |
4 Lead-free solder | p. 81 |
What's needed in the future? | p. 81 |
Lead-free soldering -- now a hot topic! | p. 83 |
The age of lead-free soldering is approaching fast | p. 87 |
ITRI | p. 88 |
5 Flux | p. 89 |
Need for flux | p. 90 |
How fluxes work | p. 91 |
Categorization of fluxes | p. 92 |
Choosing a flux | p. 98 |
Application of fluxes | p. 99 |
SC soldering process flux | p. 107 |
6 Solder paste | p. 109 |
Solder paste or adhesive application | p. 109 |
Dispensing | p. 118 |
Pin transfer | p. 122 |
Using solder paste | p. 123 |
Solder paste parameters | p. 124 |
7 CS soldering processes | p. 127 |
Hand soldering | p. 127 |
Mass CS soldering processes | p. 134 |
Inert atmosphere soldering | p. 136 |
Handling assemblies | p. 136 |
Solder pots and pumps | p. 146 |
Solder pot heaters | p. 147 |
Soldering | p. 148 |
Soldering process monitoring | p. 163 |
8 SC soldering processes | p. 165 |
Heat application | p. 165 |
Infra-red soldering | p. 167 |
Hot air convection | p. 173 |
Hot vapour soldering | p. 174 |
Laser soldering | p. 178 |
Light beam soldering | p. 182 |
Heated collet or hot bar | p. 182 |
Miscellaneous SC soldering processes | p. 185 |
Comparison of soldering processes | p. 186 |
9 Profiling soldering processes | p. 187 |
Profiles | p. 187 |
Infra-red soldering temperature profiles | p. 192 |
Hot vapour soldering temperature profiles | p. 193 |
Heated collet temperature profiles | p. 194 |
Optimizing temperature profiles | p. 195 |
10 Cleaning soldered assemblies | p. 199 |
The Montreal Protocol | p. 199 |
Why clean at all? | p. 200 |
Contamination | p. 202 |
Classifications of cleaner | p. 204 |
Cleaning processes | p. 208 |
Contamination testing | p. 218 |
Comparing the cleaning options | p. 221 |
11 Avoiding problems -- soldering quality | p. 223 |
Have problems occurred? | p. 224 |
Statistical process control | p. 224 |
Solutions to problems | p. 227 |
Criteria for the assessment of soldered joints | p. 228 |
Characteristics of soldered joints | p. 229 |
Classification of soldered joints | p. 230 |
Features of solder joints on surface mounted boards | p. 230 |
X-ray inspection | p. 232 |
Visual inspection standards | p. 235 |
Photographic guide to defects | p. 236 |
12 Standards and specifications | p. 275 |
Why comply with standards | p. 275 |
Reference to standards | p. 276 |
Levels of standards | p. 276 |
Standards organizations and bodies | p. 277 |
Standards for electronics assembly manufacture | p. 280 |
Guide to relevant worldwide standards | p. 283 |
Glossary | p. 299 |
References | p. 311 |
Further reading | p. 313 |
Worldwide addresses | p. 323 |
Appendix 1 Why not blame the machine? | p. 333 |
Appendix 2 Problems and solutions | p. 339 |
Appendix 3 Soldering safety | p. 343 |
Appendix 4 Comparing soldering processes and machines | p. 361 |
Index | p. 366 |