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Cover image for Low cost flip chip technologies : for DCA, WLSEP and PBGA assemblies

Low cost flip chip technologies : for DCA, WLSEP and PBGA assemblies

by

Lau, John H.

Author

Lau, John H.

Format:

Call Number

TK7874 L47 2000

Publisher

McGraw-Hill,

Publication Date

2000

ISBN

9780071351416

Available:
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2.

Cover image for Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies

Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies

by

Lau, John H.

Author

Lau, John H.

Format:

Call Number

TK7874 L383 2000

Publisher

McGraw-Hill,

Publication Date

2000

ISBN

9780071351416

Available:
Holds:
Copies:

3.

Cover image for Chip scale package (CSP): design, materials, processes, reliability, and applications

Chip scale package (CSP): design, materials, processes, reliability, and applications

by

Lau, John H.

Author

Lau, John H., Lee, Shi-Wei Ricky

Format:

Call Number

TK7874 L44 1999

Publisher

McGraw-Hill,

Publication Date

1998

ISBN

9780070383043

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