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Summary
Summary
In the high frequency world, the passive technologies required to realize RF and microwave functionality present distinctive challenges. SAW filters, dielectric resonators, MEMS, and waveguide do not have counterparts in the low frequency or digital environment. Even when conventional lumped components can be used in high frequency applications, their behavior does not resemble that observed at lower frequencies. RF and Microwave Passive and Active Technologies provides detailed information about a wide range of component technologies used in modern RF and microwave systems.
Updated chapters include new material on such technologies as MEMS, device packaging, surface acoustic wave (SAW) filters, bipolar junction and heterojunction transistors, and high mobility electron transistors (HMETs). The book also features a completely rewritten section on wide bandgap transistors.
Table of Contents
Preface | p. ix |
Acknowledgments | p. xi |
Editors | p. xiii |
Advisory Board | p. xv |
Contributors | p. xix |
Introduction to Microwaves and RF | p. I |
1 Overview of Microwave Engineering | p. 1 |
Section I Passive Technologies | |
2 Passive Lumped Components | p. 2 |
3 Passive Microwave Devices | p. 3 |
4 Dielectric Resonators | p. 4 |
5 RF MEMS | p. 5 |
6 Surface Acoustic Wave (SAW) Filters | p. 6 |
7 RF Coaxial Cables | p. 7 |
8 Coaxial Connectors | p. 8 |
9 Antenna Technology | p. 9 |
10 Phased Array Antenna Technology | p. 10 |
11 The Fresnel-Zone Plate Antenna | p. 11 |
12 RF Package Design and Development | p. 12 |
Section II Active Device Technologies | |
13 Varactors | p. 13 |
14 Schottky Diode Frequency Multipliers | p. 14 |
15 Transit Time Microwave Devices | p. 15 |
16 Bipolar Junction Transistors (BJTs) | p. 16 |
17 Heterostructure Bipolar Transistors (HBTs) | p. 17 |
18 Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) | p. 18 |
19 RFCMOS Modeling and Circuit Applications | p. 19 |
20 Metal Semiconductor Field Effect Transistors | p. 20 |
21 High Electron Mobility Transistors (HEMTs) | p. 21 |
22 Nitride Devices | p. 22 |
23 Microwave Vacuum Tubes | p. 23 |
24 Monolithic Microwave IC Technology | p. 24 |
25 Bringing RFICs to the Market | p. 25 |
Section III Materials Properties | |
26 Metals | p. 26 |
27 Dielectrics | p. 27 |
28 Ferroelectrics and Piezoelectrics | p. 28 |
29 Material Properties of Semiconductors | p. 29 |
Appendix A Mathematics, Symbols, and Physical Constants | p. A |
Appendix B Microwave Engineering Appendix | p. B |
Index | p. I |