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Cover image for Adhesion of 10 mm coated aggregate for chip seal application
Title:
Adhesion of 10 mm coated aggregate for chip seal application
Publication Information:
2011
Physical Description:
xvi, 70 p. : ill. ; 30 cm.
General Note:
Also available in CD-ROM : CP 052112 ra

Fulltext is available at http://dms.library.utm.my:8080

Supervisor : Dr. Haryati Yaacob
Subject Term:
Added Author:
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DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Awam - Pengangkutan dan Jalanraya)) - Universiti Teknologi Malaysia, 2011

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FKA30000007135 XX(766868.1) Reference Book UTM Project Paper (Open Shelves)
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30000010261178 QC183 M53 2011 raf Closed Access Thesis UTM Project Paper (Closed Access)
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