Skip to:Content
|
Bottom
Cover image for Thermomigration : an experimental damage mechanics study on nanoelectronic lead-free solder alloys
Title:
Thermomigration : an experimental damage mechanics study on nanoelectronic lead-free solder alloys
Personal Author:
Publication Information:
New York : University of New York at Buffalo, 2008
Physical Description:
xix, 189 p. : ill. ; 30 cm.
DSP_DISSERTATION:
Thesis (Doktor Falsafah) - University of New York at Buffalo, 2008

Available:*

Library
Item Barcode
Call Number
Material Type
Item Category 1
Status
Searching...
30000010165926 TK7874.84 M46 2008 Closed Access Thesis UTM PhD Thesis (Closed Access)
Searching...

On Order

Go to:Top of Page