Title:
Thermomigration : an experimental damage mechanics study on nanoelectronic lead-free solder alloys
Personal Author:
Publication Information:
New York : University of New York at Buffalo, 2008
Physical Description:
xix, 189 p. : ill. ; 30 cm.
DSP_DISSERTATION:
Thesis (Doktor Falsafah) - University of New York at Buffalo, 2008
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000010165926 | TK7874.84 M46 2008 | Closed Access Thesis | UTM PhD Thesis (Closed Access) | Searching... |