Title:
Numerical modeling of cyclic stress-strain behavior of Sn-Pb solder joint during thermal fatigue
Personal Author:
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
Physical Description:
[8] p. : ill. ; 29 cm.
General Note:
Vot 68313
Added Author:
Added Conference Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010071646 | TK7870.15 M63 2005 | Non Circulating UTM Special Collection Materials | 1:BOOK_ARC | Searching... |
Searching... | 30000010071647 | TK7870.15 M63 2005 | Open Access Book | Proceedings, Conference, Workshop etc. | Searching... |
Searching... | 30000010071648 | TK7870.15 M63 2005 | Open Access Book | Book | Searching... |
