Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes

Title:

Personal Author:

Publication Information:

2007

Physical Description:

1 CD-ROM ; 12 cm.

General Note:

Supervisor : Assoc. Prof. Dr. Ali Ourdjini

Also available in printed version ; TN690 N67 2007 raf

Subject Term:

DSP_DISSERTATION:

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2007

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