Title:
Effect of Ni-doping on intermetallics between Sn-3Ag-0.5Cu solders with electroless nickel/immersion gold(ENIG) surface finish
Personal Author:
Publication Information:
2012
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TK7871.85 S58 2012 raf
Supervisor : Prof. Dr. Ali Ourdjini
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 792005-2002 | XX(792005.1) | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
Searching... | 30000010294690 | CP 055290 ra | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
