Effect of ultrasonic agitation on mechanical properties of gold electroplating with lamination of copper/nickel

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Publication Information:

Sekudai : UTM, 1994

Physical Description:

1 reel : positif ; 35 mm

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1 judul dalam 1 mikrofilem

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DSP_DISSERTATION:

Project paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 1994

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