High-speed circuit board signal integrity

This engineering reference book covers the theoretical and practical aspects of high-speed digital signalling at the level of the printed circuit board.

Author Notes

Stephen C. Thierauf is presently chief scientist (technology) at SiSOFT

Preface	p. xiii
Chapter 1 Characteristics and Construction of Printed Wiring Boards	p. 1
1.1 Introduction	p. 1
1.2 Unit System	p. 1
1.3 PWB Construction	p. 2
1.3.1 Resins	p. 3
1.3.2 Alternate Resin Systems	p. 3
1.3.3 Reinforcements	p. 5
1.3.4 Variability in Building Stackups	p. 6
1.3.5 Mixing Laminate Types	p. 7
1.4 PWB Traces	p. 7
1.4.1 Copper Cladding	p. 8
1.4.2 Copper Weights and Thickness	p. 9
1.4.3 Plating the Surface Traces	p. 9
1.4.4 Trace Etch Shape Effects	p. 9
1.5 Vias	p. 10
1.5.1 Via Aspect Ratio	p. 13
1.6 Surface Finishes and Solder Mask	p. 14
1.7 Summary	p. 14
References	p. 15
Chapter 2 Resistance of Etched Conductors	p. 17
2.1 Introduction	p. 17
2.2 Resistance at Low Frequencies	p. 17
2.3 Loop Resistance and the Proximity Effect	p. 20
2.3.1 Resistance Matrix	p. 21
2.3.2 Proximity Effect	p. 22
2.4 Resistance Increase with Frequency: Skin Effect	p. 24
2.5 Hand Calculations of Frequency-Dependent Resistance	p. 27
2.5.1 Return Path Resistance	p. 28
2.5.2 Conductor Resistance	p. 28
2.5.3 Total Loop Resistance	p. 29
2.6 Resistance Increase Due to Surface Roughness	p. 29
2.7 Summary	p. 30
References	p. 30
Chapter 3 Capacitance of Etched Conductors	p. 31
3.1 Introduction	p. 31
3.2 Capacitance and Charge	p. 31
3.2.1 Dielectric Constant	p. 32
3.3 Parallel Plate Capacitor	p. 33
3.4 Self and Mutual Capacitance	p. 35
3.5 Capacitance Matrix	p. 37
3.6 Dielectric Losses	p. 39
3.6.1 Reactance and Displacement Current	p. 40
3.6.2 Loss Tangent	p. 40
3.6.3 Calculating Loss Tangent and Conductance G	p. 41
3.7 Environmental Effects on Laminate [epsilon subscript r] and Loss Tangent	p. 43
3.7.1 Temperature Effects	p. 44
3.7.2 Moisture Effects	p. 44
3.8 Summary	p. 45
References	p. 45
Chapter 4 Inductance of Etched Conductors	p. 47
4.1 Introduction	p. 47
4.2 Field Theory	p. 47
4.2.1 Permeability	p. 48
4.2.2 Inductance	p. 48
4.2.3 Internal and External Inductance	p. 49
4.2.4 Partial Inductance	p. 49
4.2.5 Reciprocity Principal and Transverse Electromagnetic Mode	p. 50
4.3 Circuit Behavior of Inductance	p. 51
4.3.1 Inductive Voltage Drop	p. 53
4.3.2 Inductive Reactance	p. 54
4.4 Inductance Matrix	p. 55
4.4.1 Using the Reciprocity Principle to Obtain the Inductance Matrix from a Capacitance Matrix	p. 55
4.5 Mutual Inductance	p. 55
4.5.1 Coupling Coefficient	p. 56
4.5.2 Beneficial Effects of Mutual Inductance	p. 57
4.5.3 Deleterious Effects of Mutual Inductance	p. 59
4.6 Hand Calculations for Inductance	p. 60
4.6.1 Inductance of a Wire Above a Return Plane	p. 60
4.6.2 Inductance of Side-by-Side Wires	p. 61
4.6.3 Inductance of Parallel Plates	p. 61
4.6.4 Inductance of Microstrip	p. 63
4.6.5 Inductance of Stripline	p. 63
4.7 Summary	p. 64
References	p. 65
Chapter 5 Transmission Lines	p. 67
5.1 Introduction	p. 67
5.2 General Circuit Model of a Lossy Transmission Line	p. 67
5.2.1 Relationship Between [omega]L and R	p. 70
5.2.2 Relationship Between [omega]C and G	p. 70
5.3 Impedance	p. 71
5.3.1 Calculating Impedance	p. 72
5.4 Traveling Waves	p. 73
5.4.1 Propagation Constant	p. 74
5.4.2 Phase Shift, Delay, and Wavelength	p. 75
5.4.3 Phase Constant at High Frequencies When R and G Are Small	p. 78
5.4.4 Attenuation	p. 79
5.4.5 Neper and Decibel Conversion	p. 80
5.5 Summary and Worked Examples	p. 82
References	p. 86
Chapter 6 Return Paths and Power Supply Decoupling	p. 87
6.1 Introduction	p. 87
6.2 Proper Return Paths	p. 87
6.2.1 Return Paths of Ground-Referenced Signals	p. 89
6.2.2 Stripline	p. 90
6.3 Stripline Routed Between Power and Ground Planes	p. 90
6.3.1 When Power Plane Voltage Is the Same as Signal Voltage	p. 90
6.3.2 When Power Plane Voltage Differs from Signal Voltage	p. 93
6.3.3 Power System Inductance	p. 94
6.4 Split Planes, Motes, and Layer Changes	p. 95
6.4.1 Motes	p. 95
6.4.2 Layer Changes	p. 98
6.5 Connectors and Dense Pin Fields	p. 98
6.5.1 Plane Perforation	p. 99
6.5.2 Antipads	p. 99
6.5.3 Nonfunctional Pads	p. 102
6.5.4 Guidelines for Routing Through Dense Pin Fields	p. 103
6.6 Power Supply Bypass/Decoupling Capacitance	p. 105
6.6.1 Power Supply Integrity	p. 106
6.6.2 Distributed Power Supply Interconnect Model	p. 110
6.7 Connecting to Decoupling Capacitors	p. 112
6.7.1 Via Inductance	p. 112
6.8 Summary	p. 114
References	p. 115
Chapter 7 Serial Communication, Loss, and Equalization	p. 117
7.1 Introduction	p. 117
7.2 Harmonic Contents of a Data Stream	p. 117
7.2.1 Line Spectra	p. 119
7.2.2 Combining Harmonics to Create a Pulse	p. 120
7.2.3 The Fourier Integral	p. 122
7.2.4 Rectangular Pulses with Nonzero Rise Times	p. 123
7.3 Line Codes	p. 125
7.4 Bit Rate and Data Rate	p. 126
7.5 Block Codes Used in Serial Transmission	p. 128
7.6 ISI	p. 130
7.6.1 Dispersion	p. 130
7.6.2 Lone 1-Bit Pattern	p. 131
7.7 Eye Diagrams	p. 132
7.8 Equalization and Preemphasis	p. 134
7.8.1 Preemphasis	p. 134
7.8.2 Passive Equalizers	p. 137
7.8.3 Passive RC Equalizer	p. 139
7.9 DC-Blocking Capacitors	p. 140
7.9.1 Calculating the Coupling Capacitor Value	p. 142
7.10 Summary	p. 145
References	p. 146
Chapter 8 Single-Ended and Differential Signaling and Crosstalk	p. 149
8.1 Introduction	p. 149
8.2 Odd and Even Modes	p. 149
8.2.1 Circuit Description of Odd and Even Modes	p. 150
8.2.2 Coupling Coefficient	p. 153
8.2.3 Stripline and Microstrip Odd- and Even-Mode Timing	p. 155
8.2.4 Effects of Spacing on Impedance	p. 157
8.3 Multiconductor Transmission Lines	p. 158
8.3.1 Bus Segmentation for Simulation Purposes	p. 159
8.3.2 Switching Behavior of a Wide Bus	p. 160
8.3.3 Simulation Results for Loosely Coupled Lines	p. 161
8.3.4 Simulation Results for Tightly Coupled Lines	p. 162
8.3.5 Data-Dependent Timing Jitter in Multiconductor Transmission Lines	p. 164
8.4 Differential Signaling, Termination, and Layout Rules	p. 165
8.4.1 Differential Signals and Noise Rejection	p. 165
8.4.2 Differential Impedance and Termination	p. 166
8.4.3 Reflection Coefficient and Return Loss	p. 170
8.4.4 PWB Layout Rules When Routing Differential Pairs	p. 172
8.5 Crosstalk	p. 173
8.5.1 Coupled-Line Circuit Model	p. 175
8.5.2 NEXT and FEXT Coupling Factors	p. 177
8.5.3 Using K[subscript b] to Predict NEXT	p. 178
8.5.4 Using K[subscript f] to Predict FEXT	p. 179
8.5.5 Guard Traces	p. 179
8.5.6 Crosstalk Worked Example	p. 180
8.5.7 Crosstalk Summary	p. 182
8.6 Summary	p. 182
References	p. 183
Chapter 9 Characteristics of Printed Wiring Stripline and Microstrips	p. 185
9.1 Introduction	p. 185
9.2 Stripline	p. 185
9.2.1 Time of Flight	p. 186
9.2.2 Impedance Relationship Between Trace Width, Thickness, and Plate Spacing	p. 187
9.2.3 Mask Biasing to Obtain a Specific Impedance	p. 189
9.2.4 Hand Calculation of Z[subscript o]	p. 189
9.2.5 Stripline Fabrication	p. 191
9.3 Microstrip	p. 193
9.3.1 Exposed Microstrip	p. 194
9.3.2 Solder Mask and Embedded Microstrip	p. 196
9.4 Losses in Stripline and Microstrip	p. 197
9.4.1 Dielectric Loss	p. 199
9.4.2 Conductor Loss	p. 199
9.5 Microstrip and Stripline Differential Pairs	p. 201
9.5.1 Broadside Coupled Stripline	p. 201
9.5.2 Edge-Coupled Stripline	p. 204
9.5.3 Edge-Coupled Microstrip	p. 205
9.6 Summary	p. 206
References	p. 207
Chapter 10 Surface Mount Capacitors	p. 209
10.1 Introduction	p. 209
10.2 Ceramic Surface Mount Capacitors	p. 209
10.2.1 Dielectric Temperature Characteristics Classification	p. 209
10.2.2 Body Size Coding	p. 211
10.2.3 Frequency Response	p. 212
10.2.4 Inductive Effects: ESL	p. 214
10.2.5 Dielectric and Conductor Losses: ESR	p. 215
10.2.6 Leakage Currents: Insulation Resistance	p. 218
10.2.7 Electrical Model	p. 219
10.2.8 MLCC Capacitor Aging	p. 220
10.2.9 Capacitance Change with DC Bias and Frequency	p. 221
10.2.10 MLCC Usage Guidelines	p. 222
10.3 SMT Tantalum Capacitors	p. 223
10.3.1 Body Size Coding	p. 223
10.3.2 Frequency Response	p. 224
10.3.3 Electrical Model	p. 225
10.3.4 Aging	p. 225
10.3.5 Effects of DC Bias, Temperature, and Relative Humidity	p. 225
10.3.6 Failure of Tantalum Capacitors	p. 226
10.3.7 ESR and Self Heating: Voltage and Temperature Derating	p. 227
10.3.8 Usage Guidelines	p. 227
10.4 Replacing Tantalum with High-Valued Ceramic Capacitors	p. 228
References	p. 230
Appendix Conversion Factors	p. 231
About the Author	p. 233
Index	p. 235

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Author Notes

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