Title:
Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints
Series:
Siri kertas kerja penyelidikan (Universiti Teknologi Malaysia. Pusat Pengurusan Penyelidikan)
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2007
Available:*
Library | Item Barcode | Material Type | Item Category 1 | Status |
|---|---|---|---|---|
Searching... | 30000010164922 | Non Circulating UTM Special Collection Materials | Article | Searching... |
