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Material Type: Open Access Book

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Subject: Printed circuits -- Design and construction

Author

Hwang, Jennie S.

(2)

Kirkpatrick, James M.

(2)

(2)

Zuwairie Ibrahim

(2)

Asian Control Conference (4th : 2002 : Singapore)

(1)

Avtgis, Alexander W., 1931-

(1)

Bosshart, Walter C.

(1)

Brindley, Keith

(1)

Edwards, Philip R.

(1)

IEEE Electromagnetic Compatibility Society

(1)

(1)

Khandpur, Raghbir Singh, 1942-

(1)

Megow, William F., 1936-

(1)

Montrose, Mark I.

(1)

(1)

(1)

SICE 2002 (2002 : Osaka, Japan)

(1)

Syed Abdul Rahman Al-Attas

(1)

Syed Abdul Rahman Syed Abu Bakar

(1)

Thierauf, Stephen C.

(1)

Villanucci, Robert S., 1944-

(1)

Language

(15)

Format

(15)

Subject

Electronic drafting

(3)

Electronic circuits

(2)

Image transmission

(2)

Printed circuits -- Inspection

(2)

(2)

Surface mount technology

(2)

Wavelets (Mathematics)

(2)

Electromagnetic compatibility

(1)

Electromagnetic interference

(1)

Electronic apparatus and appliances -- Design and construction

(1)

Electronic circuit design

(1)

Electronic circuits -- Noise

(1)

Electronic industries

(1)

Electronic industries -- Planning

(1)

Electronic industries -- Production control

(1)

Electronic packaging

(1)

Solder and soldering

(1)

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1.

Cover image for Printed circuit boards : design, fabrication, assembly and testing

Printed circuit boards : design, fabrication, assembly and testing

Printed circuit boards : design, fabrication, assembly and testing

by

Khandpur, Raghbir Singh, 1942-

Author

Khandpur, Raghbir Singh, 1942-

Format:

Call Number

TK7868.P7 K42 2006

Publisher

McGraw-Hill,

Publication Date

2006

ISBN

9780071464208

Available:
Holds:
Copies:

SD_ILS:442707

2.

Cover image for High-speed circuit board signal integrity

High-speed circuit board signal integrity

by

Thierauf, Stephen C.

Author

Thierauf, Stephen C.

Format:

Call Number

TK7868.P7 T44 2004

Publisher

Artech House,

Publication Date

2004

ISBN

9781580531313

Available:
Holds:
Copies:

SD_ILS:418031

3.

Cover image for Model-based PCB inspection technique using wavelet transform

Model-based PCB inspection technique using wavelet transform

Model-based PCB inspection technique using wavelet transform

by

Zuwairie Ibrahim

Author

Zuwairie Ibrahim, Syed Abdul Rahman Al-Attas, Zulfakar Aspar, Asian Control Conference (4th : 2002 : Singapore)

Format:

Call Number

TK7868.P7 Z88 2002

Publisher

Universiti Teknologi Malaysia,

Publication Date

2002

Available:
Holds:
Copies:

SD_ILS:322007

4.

Cover image for Analysis of the wavelet-based image difference algorithm for PCB inspection

Analysis of the wavelet-based image difference algorithm for PCB inspection

Analysis of the wavelet-based image difference algorithm for PCB inspection

by

Zuwairie Ibrahim

Author

Zuwairie Ibrahim, Syed Abdul Rahman Syed Abu Bakar, Zulfakar Aspar, SICE 2002 (2002 : Osaka, Japan)

Format:

Call Number

TK7868.P7 Z89 2002

Publisher

Universiti Teknologi Malaysia,

Publication Date

2002

Available:
Holds:
Copies:

SD_ILS:316499

5.

Cover image for EMC and the printed circuit board : design, theory, and layout made simple

EMC and the printed circuit board : design, theory, and layout made simple

by

Montrose, Mark I.

Author

Montrose, Mark I., IEEE Electromagnetic Compatibility Society

Format:

Call Number

TK7868.P7 M65 1999

Publisher

IEEE Press,

Publication Date

1999

ISBN

9780780347038

Available:
Holds:
Copies:

SD_ILS:372063

6.

Cover image for Soldering in electronics assembly

Soldering in electronics assembly

by

Judd, Mike

Author

Judd, Mike, Brindley, Keith

Format:

Call Number

TK7868.P7 J83 1999

Edition

2nd ed.

Publisher

Newnes,

Publication Date

1999

ISBN

9780750635455

Available:
Holds:
Copies:

SD_ILS:108510

7.

Cover image for Management of electronics assembly : design development, production, test

Management of electronics assembly : design development, production, test

Management of electronics assembly : design development, production, test

by

Oakes, Ian

Author

Oakes, Ian

Format:

Call Number

TK7836.O25 1992

Publisher

Newnes,

Publication Date

1992

ISBN

9780750600712

Available:
Holds:
Copies:

SD_ILS:125299

8.

Cover image for Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly

Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly

Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly

by

Hwang, Jennie S.

Author

Hwang, Jennie S.

Format:

Call Number

TK7868.P7 H82 1992

Edition

Paperback ed

Publisher

Van Nostrand Reinhold,

Publication Date

1992

ISBN

9780442013530

Available:
Holds:
Copies:

SD_ILS:302153

9.

Cover image for Manufacturing technology in the electronic industry : an introduction

Manufacturing technology in the electronic industry : an introduction

Manufacturing technology in the electronic industry : an introduction

by

Edwards, Philip R.

Author

Edwards, Philip R.

Format:

Call Number

TK7836.E38 1991

Publisher

Chapman Hall,

Publication Date

1991

ISBN

9780412371301

Available:
Holds:
Copies:

SD_ILS:111021

10.

Cover image for Surface mount technology: principles and practice

Surface mount technology: principles and practice

Surface mount technology: principles and practice

by

Prasad, Ray P.

Author

Prasad, Ray P.

Format:

Call Number

TK7868.P7 P72 1989

Publisher

Van Nostrand Reinhold,

Publication Date

1989

ISBN

9780442205270

Available:
Holds:
Copies:

SD_ILS:181828

11.

Cover image for Electronic drafting and printed circuit board design

Electronic drafting and printed circuit board design

by

Kirkpatrick, James M.

Author

Kirkpatrick, James M.

Format:

Call Number

TK7866.K57 1989

Edition

2nd ed.

Publisher

Delmar Pub.,

Publication Date

1989

ISBN

9780827332850

Available:
Holds:
Copies:

SD_ILS:256317

12.

Cover image for Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly

by

Hwang, Jennie S.

Author

Hwang, Jennie S.

Format:

Call Number

TK7868.P7 H82 1989

Publisher

Van Nostrand Reinhold,

Publication Date

1989

ISBN

9780442207540

Available:
Holds:
Copies:

SD_ILS:483100

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