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Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000010283754 | TJ1280 A383 2012 | Open Access Book | Book | Searching... |
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Summary
Summary
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community.
Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.
Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.
Author Notes
Toshiro Doi is a Professor in the Department of Mechanical Engineering at Kyushu University, Japan. He earned his PhD from the University of Tokyo in 1985. He was a visiting professor at the University of Arizona in USA from 2003 to 2005. His research covers precision processing including CMP technology and its applications. He is chairman of the Japan Society for Precision Engineering's Planarization CMP Committee, and of the Japan Society for the Promotion of Science's 136th Committee on Future-oriented Machining.
Ioan D. Marinescu is Professor of Mechanical, Industrial and Manufacturing Engineering at the University of Toledo. He is also the Director of the Precision Micro-Machining Center at Toledo University's College of Engineering. He has a PhD in Manufacturing Processes, an Honorary Doctorate from University of lashi, Romania, and is member of numerous international professional organizations: JSPE, SME, ASME, ASPE, CIRP, IDA, ASAT, NAMRI.
Syuhei, Kurokawa is currently an Associate Professor in the Department of Mechanical Engineering at Kyushu University. His research fields include the measurement and evaluation of gear accuracy, characterization of surface topography, nanomachining of micro machine elements and measuring devices, and planarization CMP technology of device wafers.
Table of Contents
| Contributors | p. vii |
| Preface | p. ix |
| About the Authors | p. xi |
| 1 Introduction | p. 1 |
| References | p. 2 |
| 2 Details of the Fabrication Process for Devices with a Silicon Crystal Substrate | p. 3 |
| 2.1 History of Semiconductor Devices and their Types | p. 3 |
| 2.2 Semiconductor Device Process Technology and Current Situation | p. 7 |
| References | p. 13 |
| 3 The Current Situation in Ultra-Precision Technology û Silicon Single Crystals as an Example | p. 15 |
| 3.1 Production of Single Crystal Silicon | p. 17 |
| 3.2 Slicing: Pre- and Post-Process | p. 19 |
| 3.3 Lapping of Silicon | p. 35 |
| 3.4 Etching | p. 86 |
| 3.5 Ultra-Precision Polishing/CMP of Silicon Wafers | p. 90 |
| 3.6 Precision Cleaning (Wet Cleaning) | p. 96 |
| 3.7 Inspection of Crystal Substrate | p. 100 |
| References | p. 110 |
| 4 Applications of Ultra-Precision CMP in Device Processing | p. 113 |
| 4.1 Overview of the Significance of, and Trends in, Planarization CMP | p. 113 |
| 4.2 Basic Structure of the CMP System | p. 119 |
| 4.3 Element Technology | p. 130 |
| 4.4 Role of Slurry in CMP | p. 144 |
| 4.5 Role of Pads in CMP | p. 156 |
| 4.6 Advanced Evaluation of Pad Surface Texture | p. 172 |
| 4.7 Cleaning after CMP | p. 179 |
| 4.8 Surface Defects and Inspection Tools in CMP | p. 189 |
| 4.9 Planarization Simulation Technique (Prediction/Management/Evaluation Technique) | p. 209 |
| References | p. 226 |
| 5 Promising Future Processing Technology | p. 229 |
| 5.1 Electrolytic CMP (E-CMP) and Applied Techniques | p. 229 |
| 5.2 ELID Grinding of Sapphire - Experimental Approach | p. 242 |
| 5.3 ELID Grinding of Sapphire with Acoustic Emission Monitoring | p. 252 |
| 5.4 Novel Bell-Jar Shaped, Sealed, Atmosphere Controlled CMP Machine, and Precision Processing of Various Functional Materials | p. 262 |
| 5.5 Dry Etching and Planarization CMP Applications for Surface Micro-Machining | p. 273 |
| References | p. 293 |
| 6 Progress of the Semiconductor and Silicon Industries - Growing Semiconductor Markets and Production Areas | p. 297 |
| 6.1 A Paradigm Shift in the" Semiconductor Industry | p. 297 |
| 6.2 Correlation Between the Electronics and Single Crystal Silicon Wafer Industry | p. 300 |
| 6.3 Analysis of Single Crystal Silicon Wafer Market for the Semiconductor Industry | p. 301 |
| References | p. 304 |
| 7 Summary - The Future of CMP/Polishing Technologies | p. 305 |
| Index | p. 309 |
