Cover image for Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
Title:
Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
Personal Author:
Publication Information:
2008
Physical Description:
xxii, 137 p. : ill. ; 30 cm.
General Note:
Also available in CD-ROM : CP 017324 ra

Supervisor : Assoc. Prof. Dr Ali Ourdjini
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Mekanikal – Bahan))- Universiti Teknologi Malaysia, 2008

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30000010188389 TS610 S24 2008 raf Closed Access Thesis UTM Master Thesis (Closed Access)
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SPS30000002194 TS610 S24 2008 raf Closed Access Thesis UTM Master Thesis (Closed Access)
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