Cover image for Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish
Title:
Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish
Personal Author:
Publication Information:
2011
Physical Description:
xvi, 101 p. : ill. ; 30 cm.
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini

Also available in CD-ROM : CP 031577 ra
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Added Author:
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DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011

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FKM30000006080 XX(774356.1) Closed Access Thesis UTM Project Paper (Closed Access)
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30000010269426 TS610 K65 2011 raf Closed Access Thesis UTM Project Paper (Closed Access)
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