Title:
Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes
Personal Author:
Publication Information:
2008
Physical Description:
xx, 190 p. : ill. ; 30 cm.
General Note:
Also available in CD-ROM : CP 017133 ra
Supervisor : Assoc. Prof. Dr Ali Ourdjini
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2008
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000005347 | TK7870.15 S62 2008 raf | Closed Access Thesis | UTM Master Thesis (Closed Access) | Searching... |
Searching... | 30000010188379 | TK7870.15 S62 2008 raf | Closed Access Thesis | UTM Master Thesis (Closed Access) | Searching... |
Searching... | SPS30000002199 | TK7870.15 S62 2008 raf | Closed Access Thesis | UTM Master Thesis (Closed Access) | Searching... |
