Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes

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Research Monograph (Universiti Teknologi Malaysia. Research Management Centre)

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2007

Physical Description:

xiv, 174 p. : ill. ; 30 cm.

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Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... Perpustakaan Raja Zarith Sofiah	30000010267533	TT267 A45 2007 af	Non Circulating UTM Special Collection Materials	Research Report (Closed Access)	Searching... Unknown
Searching... PSZ JB	30000010267534	TT267 A45 2007 af	Open Access Book	UTM Special Collection (Open Shelves)	Searching... Unknown
Searching... PSZ KL	30000010267535	TT267 A45 2007 af	Open Access Book	UTM Special Collection (Open Shelves)	Searching... Unknown