Cover image for Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish
Title:
Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish
Personal Author:
Publication Information:
2009
Physical Description:
xv, 107 p. : ill. ; 30 cm
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini

Also available in CD-ROM : CP 0513354 ra
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DSP_DISSERTATION:
Thesis (Sarjana Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2009

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30000010189871 TS610 A95 2009 raf Closed Access Thesis UTM Master Thesis (Closed Access)
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