Accelerated stress testing handbook : guide for achieving quality products

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New York : IEEE Press, 2001

ISBN:

9780780360259

Subject Term:

Electronic apparatus and appliances -- Testing

Electronic apparatus and appliances -- Reliability

Environmental testing

Added Author:

Chan, H. Anthony, 1952-

Englert, Paul J., 1960-

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Searching... PSZ JB	30000010047111	TK7870.23 A22 2001	Open Access Book	Book	Searching... Unknown

As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules will increase. Part of a designer's "toolbox" for achieving product reliability in a compressed time frame should be a set of best practices for utilizing accelerated stress testing (AST).

The Accelerated Stress Testing Handbook delineates a core set of AST practices as part of an overall methodology for enhancing hardware product reliability. The techniques presented will teach readers to identify design deficiencies and problems with component quality or manufacturing processes early in the product's life, and then to take corrective action as quickly as possible. A wide array of case studies gleaned from leading practitioners of AST supplement the theory and methodology, which will provide the reader with a more concrete idea of how AST truly enhances quality in a reduced time frame.

Important topics covered include:

Theoretical basis for AST General AST best practices AST design and manufacturing processes AST equipment and techniques AST process safety qualification In this handbook, AST cases studies demonstrate thermal, vibration, electrical, and liquid stress application; failure mode analysis; and corrective action techniques. Individuals who would be interested in this book include: reliability engineers and researchers, mechanical and electrical engineers, those involved with all facets of electronics and telecommunications product design and manufacturing, and people responsible for implementing quality and process improvement programs.

Author Notes

About the Editors H. Anthony Chan has been with AT&T Labs and the former AT&T Bell Labs for 14 years, specializing in product development and manufacturing, including interconnection technology, manufacture assembly and reliability, network management, and wireless network. He has been responsible for R&D in robust product design and manufacture and for guiding various manufacturing locations in planning and conducting reliability and stress testing programs. Dr. Chan has taught several training courses in reliability and stress testing and is a regular speaker on these topics. Moreover, he is an adjunct faculty member at the Hong Kong Polytechnic University.
Paul J. Englert is a distinguished member of the technical staff in the Product Realization Department of Lucent Technologies' Wireless Networks Group. He is responsible for wide-scale deployment of mechanical computer-aided design (CAD) and work-in-progress data management solutions. Also, Dr. Englert develops Web-based, multimedia training tools for engineering practices and CAD tools and has lectured in China, Singapore, South Korea, and Taiwan on these subjects. Also, his experience spans a broad spectrum of projects in assembly, manufacturing, stress testing, chemical solvent replacement process development, and statistical modeling.

Frank IannaH. Anthony Chan and Paul J. EnglertH. Anthony Chan and Paul J. EnglertH. Anthony Chan and Paul J. EnglertH. Anthony Chan and Paul J. EnglertH. Anthony Chan and Paul J. EnglertH. Anthony Chan and Paul J. EnglertClifton J. SeusyGreg PfeifferCharles FelkinsWayne TustinKing Lo and Frank LoVascoKumar Upadhyayula and Abhijit DasguptaPaul J. EnglertS. RajaramDennis E. PachukiCharles SchinnerDonald DallandEdmond L. KyserHarry McLeanT. Paul Parker and Gordon L. HarrisonKevin GranlundHenry Malec

Foreword	p. xvii
Preface	p. xix
Acknowledgments	p. xxi
Part I Overview	p. 1
Chapter 1 Introduction	p. 3
1.1 Synopsis of Reliability Trends and Aim of Book	p. 3
1.2 Background of Military and Industrial Stress Testing Practices	p. 5
1.3 Overview of the AST Handbook	p. 6
References	p. 9
Chapter 2 Principles of Stress Testing	p. 10
2.1 Rationale for Stress Testing	p. 11
2.1.1 Product Robustness	p. 11
2.1.2 AST and Accelerated Testing	p. 12
2.1.3 AST and the Bath-Tub Curve	p. 14
2.1.4 Bimodal Product Strength Distribution	p. 14
2.1.5 Relevance of AST Failures	p. 17
2.1.6 Types of Stress Failures	p. 18
2.2 Stress Testing Technical and Implementation Issues	p. 19
2.2.1 Modes of AST	p. 19
2.2.2 Other Forms of Stress Testing	p. 20
2.2.3 Stress Stimuli and Flaws Precipitated by Them	p. 21
2.2.4 Stress Stimuli Selection	p. 22
2.2.5 Stress Level Determination	p. 23
2.2.6 Safety Testing	p. 23
2.2.7 Fault Simulation and Detection Issues	p. 24
2.2.8 Form of Product to Test	p. 25
2.3 Economic Issues	p. 27
2.3.1 Benefits	p. 27
2.3.2 Cost of AST	p. 27
2.3.3 Optimizing the Application of AST	p. 28
References	p. 29
Part II Process and Guidelines	p. 31
Chapter 3 Stress Testing Program: Generic Processes	p. 33
3.1 Overview of the Stress Testing Strategy	p. 33
3.1.1 Select AST Options	p. 36
3.2 Design Stress Testing (D-AST)	p. 36
3.2.1 Plan Program (A)	p. 36
3.2.2 Baseline Product (B)	p. 36
3.2.3 Take Corrective Action (C)	p. 37
3.3 Manufacturing Qualification Stress Testing (MQ-AST)	p. 38
3.3.1 Plan Program (A)	p. 39
3.3.2 Baseline Product (B)	p. 39
3.3.3 Take Corrective Action (C)	p. 39
3.3.4 Develop Manufacturing AST Regimen (D)	p. 39
3.3.5 Demonstrate Safety of the AST Regimen (E)	p. 40
3.3.6 Perform Manufacturing AST (F)	p. 40
3.4 Periodic Qualification Stress Testing (PQ-AST)	p. 40
3.5 Production Sampling Stress Test (PS-AST)	p. 41
3.5.1 Plan Program (A)	p. 41
3.5.2 Develop Manufacturing AST Regimen (D)	p. 41
3.5.3 Perform Manufacturing AST Regimen (F)	p. 42
3.5.4 Take Corrective Action (C)	p. 42
3.5.5 Optimize Manufacturing AST Regimen (G)	p. 43
3.6 Full Production Stress Testing (FP-AST)	p. 43
Chapter 4 Stress Testing Program Subprocesses	p. 44
4.1 Plan Program Subprocess (A)	p. 44
4.1.1 TASK 1: Form Team and Develop AST Strategy	p. 44
4.1.2 TASK 2: Review and Issue AST Strategy	p. 46
4.1.3 TASK 3: Write the AST Plan	p. 47
4.1.4 TASK 4: Review and Issue AST Plan	p. 47
4.1.5 TASK 5: AST Tools Realization	p. 48
4.2 Baseline Product Subprocess (B)	p. 50
4.2.1 TASK 1: Baseline Product	p. 50
4.3 Take Corrective Action Subprocess (C)	p. 51
4.3.1 TASK 1: Analyze AST Results	p. 51
4.3.2 TASK 2: Suggest and Review Corrective Actions	p. 53
4.3.3 TASK 3: Develop AST Verification Plan for Corrective Action	p. 54
4.3.4 TASK 4: Issue Summary of Lessons Learned	p. 55
4.4 Develop Manufacturing Stress Testing Regimen Subprocess (D)	p. 55
4.4.1 TASK 1: Determine the Form of Product to be Tested	p. 55
4.4.2 TASK 2: Determine What Stress Stimuli Are Effective	p. 56
4.5 Demonstrate Safety of the Stress Testing Regimen Subprocess (E)	p. 57
4.5.1 TASK 1: Develop AST Safety Strategy	p. 58
4.5.2 TASK 2: Write AST Safety Qualification Plan	p. 58
4.5.3 TASK 3: Execute Safety Qualification Plan	p. 59
4.5.4 TASK 4: Analyze Safety Test Data	p. 60
4.5.5 TASK 5: Certify Safety of Candidate AST Regimen	p. 61
4.6 Perform Manufacturing Stress Testing Subprocess (F)	p. 61
4.6.1 TASK 1: Execute AST Plan	p. 61
4.7 Optimize the Manufacturing Stress Testing Regimen Subprocess (G)	p. 62
4.7.1 TASK 1: Analyze Manufacturing AST Regimen Data	p. 62
4.7.2 TASK 2: Select Manufacturing AST Mode or Regimen	p. 64
4.7.3 TASK 3: Develop Evaluation Plan for Trial AST Regimen	p. 64
4.7.4 TASK 4: Conduct Evaluation of Trial AST Regimen	p. 65
Chapter 5 Guidelines for Design and Manufacturing Stress Testing	p. 66
5.1 AST Test Strategy	p. 66
5.2 AST Plan	p. 68
5.3 Sample Size Selection for Design AST	p. 69
5.4 Typical Stress Stimuli and Associated Product Flaws	p. 70
5.5 Recommended Stress Levels	p. 71
5.6 Baseline Product Test Procedures	p. 77
5.7 Failure Mode Analysis and Root Cause Analysis	p. 83
5.7.1 Failure Types and Modes Found During Stress Testing	p. 85
5.8 Corrective Action and Product Ruggedization	p. 87
5.8.1 Design AST Database	p. 87
References	p. 90
Part III Theory	p. 91
Chapter 6 Economics and Optimization	p. 93
6.1 Guidelines for Optimizing Manufacturing Stress Testing	p. 93
6.1.1 Product Attributes	p. 93
6.1.2 Environment for Stress Testing	p. 94
6.1.3 The Optimization Process	p. 95
6.1.4 Effectiveness of the Stress Regimen	p. 96
6.1.5 A/B Comparisons	p. 97
6.2 Formulation	p. 97
6.3 Reliability Objective	p. 98
6.4 Types of Failures Revisited	p. 98
6.5 Distribution of Environmental Stresses	p. 98
6.6 Effect of Stress Testing	p. 100
6.7 Reliability Requirements	p. 101
6.8 Requirement on Service-Life Fraction Failed	p. 101
6.9 Requirement on Product Strength Distribution	p. 102
6.10 Examples	p. 103
6.10.1 1 in 100 Service-Life Fraction Failed Requirements	p. 104
6.10.2 1 in 1000 Service-Life Fraction Failed Requirements	p. 104
6.11 Economic Issues and Optimization	p. 105
6.11.1 Reduction in Field Failure Rate	p. 105
6.11.2 Potential Benefits	p. 105
6.11.3 Potential Costs	p. 106
6.12 Net Benefit	p. 106
6.13 Optimization	p. 107
6.14 Product Considerations	p. 108
6.15 Economic Summary	p. 108
References	p. 108
Chapter 7 Reliability Growth	p. 109
7.1 What Is Reliability Growth?	p. 109
7.2 How Many Units Must Be Tested?	p. 110
7.2.1 Binomial Probabilities	p. 110
7.3 Failure Mode Distribution	p. 111
7.3.1 Mathematical Substantiation	p. 113
7.3.2 Kuklinski Curves	p. 114
7.4 How Are These Units Acquired?	p. 118
7.4.1 Prototype Production	p. 118
7.4.2 Final Product Production	p. 119
7.5 The Success of Failures Attained by Stress Testing	p. 120
7.5.1 Generic Stresses	p. 120
7.5.2 Product-Specific Stresses and Stress Levels	p. 120
7.5.3 Relevance of Stress Failures	p. 121
7.5.4 Addressing All Failure Modes	p. 122
7.5.4.1 Design Defect Tracking	p. 123
7.5.4.2 Failure Analysis	p. 124
7.6 Results	p. 124
7.7 Conclusions	p. 125
Acknowledgments	p. 125
References	p. 126
Chapter 8 Overview of the Failure Analysis Process for Electrical Components	p. 127
8.1 Definition of Failure Analysis	p. 127
8.2 The Benefits of Performing Failure Analysis	p. 127
8.3 Overview of the Failure Analysis Process for Electrical Components	p. 128
8.3.1 Understand the Problem	p. 128
8.3.2 Examine the Component Package with a Low-Power Microscope	p. 128
8.3.3 Verify the Failure	p. 128
8.3.4 Nondestructive Evaluation	p. 128
8.3.5 Stop, Think, and Plan!	p. 129
8.3.6 Decapsulate the Device	p. 129
8.3.7 Examine the Interior of the Package and the Die Surface	p. 129
8.3.8 Conduct a Physical Analysis	p. 129
8.3.9 Evaluate the Data and Come to a Conclusion	p. 129
8.3.10 Develop a Corrective Action Recommendation	p. 129
8.3.11 Write and Issue a Report (as Required by the Customer)	p. 130
8.3.12 Archive the Data and Samples	p. 130
8.3.13 Follow Up on Customer's Corrective Action Results	p. 130
8.4 Tools for Component Failure Analysis	p. 130
8.4.1 Basic (Tools that Every Lab Needs)	p. 130
8.4.2 Additional Tools	p. 131
8.5 Personnel for Component Failure Analysis	p. 131
8.6 Challenges Facing Failure Analysts in the Future	p. 131
8.7 What the Customer Can Do to Optimize the Failure Analysis Process	p. 132
References	p. 132
Part IV Equipment and Techniques	p. 135
Chapter 9 Accelerated Stress Testing Equipment and Techniques	p. 137
9.1 Introduction	p. 137
9.2 Thermal Equipment	p. 137
9.2.1 Operating Temperature Range	p. 138
9.2.2 Temperature Rate of Change	p. 138
9.2.3 Mechanical Refrigeration versus Liquid Nitrogen (LN[subscript 2]) Cooling	p. 140
9.2.4 LN[subscript 2] Implementation	p. 141
9.3 Vibration Equipment	p. 142
9.3.1 Issues for Repetitive Shock Machines Using Pneumatic Vibrators	p. 144
9.3.2 Multi-Axial Considerations for Repetitive Shock Machines	p. 145
9.3.3 Table Resonances for Repetitive Shock Machines	p. 147
9.3.4 g[subscript RMS] versus Peak G Stress	p. 147
9.4 Combined Thermal and Vibration Equipment	p. 147
9.5 Ancillary Mechanical Equipment for Stress Testing	p. 148
9.5.1 Fixturing for Vibration Stressing	p. 148
9.5.2 Printed Wiring Board Card Cages Used for Stress Testing	p. 149
9.6 Environmental Analysis Equipment Used for Stress Testing	p. 152
9.7 Electrical Test Equipment and Software Used for Stress Testing	p. 153
9.7.1 AST Test Equipment Hardware	p. 153
9.7.2 AST Test Equipment Software	p. 153
9.8 Other Stress Options	p. 154
Chapter 10 Vibration and Shock Inputs Identify Some Failure Modes	p. 155
10.1 Why Important?	p. 155
10.2 Vibration Measurements	p. 155
10.2.1 Prior Knowledge	p. 155
10.2.2 Vibration and Shock Measurement--Units	p. 157
10.2.3 Vibration and Shock Sensors (Field and Laboratory)	p. 159
10.2.3.1 Displacement Sensors	p. 159
10.2.3.2 Velocity Sensors	p. 160
10.2.3.3 Accelerometers	p. 160
10.2.3.4 Force Sensors	p. 161
10.2.4 Signal Conditioning	p. 162
10.2.5 Display and Recording Instruments	p. 163
10.2.6 Sources of Sensor Error	p. 163
10.3 Controllable Sources of Vibration and Mechanical Shock	p. 164
10.3.1 Electrodynamic (Electromagnetic) Shakers	p. 164
10.3.1.1 Shaker Armature	p. 164
10.3.1.2 Magnetic Field	p. 165
10.3.1.3 Alternating Current Generates Force	p. 165
10.3.1.4 Force Ratings	p. 165
10.3.1.5 Vertical or Horizontal Thrusting	p. 167
10.3.1.6 Isolation from Building	p. 167
10.3.2 Power Amplifiers	p. 167
10.3.2.1 Delivering Adequate Alternating Current for Shaker Driver Coil	p. 167
10.3.2.2 Momentary Power Peaks	p. 168
10.3.2.3 Importance of Low Distortion	p. 168
10.3.2.4 Direct Current for Shaker Field Winding	p. 168
10.3.3 Controls	p. 168
10.3.3.1 Controls for Sine Vibration Testing	p. 169
10.3.3.2 Controls for Random Vibration Testing	p. 169
10.3.3.3 Tolerances	p. 169
10.3.3.4 Abort Limits	p. 169
10.3.3.5 Controls for Shock Testing	p. 170
10.3.4 Test Fixtures	p. 170
10.4 Characteristics of Shock, Sine, and Random Vibration	p. 170
10.4.1 Mechanical Shock Pulse	p. 170
10.4.2 Sinusoidal Vibration and Its Effects	p. 172
10.4.3 Random Vibration and Its Effects	p. 173
10.4.4 Amplitude Probability Density	p. 174
10.4.5 Acceleration Spectral Density	p. 176
10.5 Multi-Axis Excitation	p. 176
10.6 Repetitive Shock Machines for Multi-Axis Stress Testing	p. 178
10.7 Using Random Vibration and Repetitive Shock for Stress Testing	p. 178
10.7.1 What Spectrum?	p. 179
10.7.2 What Intensity?	p. 180
10.7.3 For How Long?	p. 180
10.7.4 Is Our Production Screening Damaging Good Hardware?	p. 180
Chapter 11 Relative Effectiveness of Thermal Cycling Versus Burn-In	p. 182
11.1 Introduction	p. 182
11.2 Results for Thermal Cycling Alone	p. 183
11.3 Intermittents and First Events	p. 183
11.4 Thermal Cycling versus Burn-In	p. 185
11.5 Failure Mechanisms	p. 186
11.6 Conclusion	p. 187
Acknowledgments	p. 188
Chapter 12 Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid?	p. 189
12.1 Introduction	p. 190
12.2 Combined Temperature and Vibration Accelerated Life Tests	p. 191
12.3 The Macroscopic Incremental Damage Superposition Approach (Macro-IDSA)	p. 194
12.4 The Micromechanistic Incremental Damage Superposition Approach (Micro-IDSA)	p. 197
12.5 Conclusions	p. 200
Acknowledgments	p. 201
References	p. 201
Chapter 13 Liquid Environmental Stress Testing (Lest)	p. 203
13.1 Advantages of Liquid Environmental Stress Testing	p. 203
13.2 Liquid Environmental Stress Testing Facility	p. 204
13.2.1 Overview of LEST Facility Features	p. 204
13.3 Thermal Considerations in Liquid Environmental Stress Testing	p. 208
13.4 Conclusions	p. 214
References	p. 214
Chapter 14 Safety Qualification of Stress Testing	p. 216
14.1 Stress Testing Safety Qualification Program	p. 217
14.1.1 Generic Component Qualification	p. 219
14.1.1.1 IC Qualification	p. 219
14.1.1.2 Discrete Component Qualification	p. 220
14.1.2 Specific Code Qualification	p. 220
14.1.2.1 The Qualification Process	p. 221
14.1.2.2 AST with Voltage Bias	p. 221
14.1.2.3 THB Testing	p. 222
14.1.2.4 Product Destruct Limit Testing	p. 223
14.2 Safety Qualification Programs for Other Types of Stresses	p. 223
References	p. 224
Part V Best Practices Case Studies in Computer, Communications, and Other Industries	p. 227
Chapter 15 Production Ast With Computers Using the Taguchi Method	p. 229
15.1 Introduction	p. 229
15.2 Objectives	p. 230
15.3 Stress Overview	p. 230
15.4 Stress Screen Designs	p. 230
15.4.1 Temperature Range	p. 230
15.4.2 Temperature Change Rate	p. 231
15.4.3 Power Cycling	p. 231
15.4.4 Vibration Screen Determination	p. 231
15.4.5 Fixture Design	p. 232
15.4.6 Vibration Stress Duration	p. 232
15.4.7 Diagnostic Monitoring	p. 232
15.5 Experiment Overview	p. 232
15.5.1 Test Process Product Flow	p. 233
15.6 The Taguchi Method	p. 234
15.6.1 Sample Size Selection	p. 235
15.7 Response Variable Results and Conclusions of the Taguchi Experiment	p. 236
15.7.1 Triaxial Random Vibration	p. 236
15.7.2 Temperature Cycling	p. 237
15.7.3 Power Cycling	p. 237
15.8 Intra-Experiment Summary	p. 237
15.9 Taguchi Method Conclusion	p. 238
15.10 Terms	p. 239
Acknowledgments	p. 239
References	p. 239
Chapter 16 Design Ast With Vendor Electronics	p. 240
16.1 Introduction	p. 240
16.2 The Test-Analyze-Correct-Verify Process	p. 240
16.3 Accelerated Reliability Techniques (ART)	p. 242
16.3.1 Stress Tool Box	p. 243
16.3.2 Broad Spectrum Stress Portfolio	p. 243
16.4 Original Equipment Manufacturer (OEM) Power Supply Example	p. 244
16.5 Conclusions	p. 251
Acknowledgments	p. 252
References	p. 252
Chapter 17 Design and Production Ast With Power Supplies	p. 253
17.1 Background	p. 253
17.1.1 Switching Power Supplies	p. 253
17.2 STRIFE in New Product Development (Design AST)	p. 253
17.2.1 Vibration	p. 254
17.2.2 Thermal Test	p. 255
17.2.3 Electrical Overstress	p. 256
17.2.4 Power Cycling	p. 256
17.2.5 Results	p. 256
17.2.6 Conclusions with STRIFE in Product Development (Design AST)	p. 257
17.3 ESS in Manufacturing (Production AST)	p. 257
17.3.1 Burn-In	p. 257
17.3.1.1 Burn-In Conditions	p. 258
17.3.1.2 Results	p. 258
17.3.2 Vibration Screening	p. 259
17.3.2.1 Conditions	p. 259
17.3.2.2 Results	p. 260
17.3.3 Conclusions with ESS in Manufacturing (Production AST)	p. 260
17.4 Final Conclusions	p. 261
Acknowledgments	p. 262
Chapter 18 Design and Production Ast With Computers	p. 263
18.1 Background	p. 263
18.1.1 A Massively Parallel RISC-Based Server	p. 263
18.2 The ESS Program	p. 263
18.2.1 Integration	p. 264
18.3 Conclusions	p. 268
Acknowledgments	p. 268
Definitions and Acronyms	p. 268
Reference	p. 268
Chapter 19 Qualifications and Production Sampling Ast With Printed Circuit Boards	p. 269
19.1 Introduction	p. 269
19.2 Proposed Test and Theory	p. 270
19.3 Ongoing Monitoring of the Production Process	p. 271
19.4 Screen Development	p. 273
19.5 Equipment	p. 274
19.6 Results of the Initial Testing	p. 275
19.7 Conclusions	p. 278
Acknowledgments	p. 280
Glossary	p. 280
References	p. 281
Chapter 20 Manufacturing Ast With Telecommunication Products	p. 282
20.1 Introduction	p. 282
20.2 EST During Product Design (Design AST)	p. 284
20.3 Production EST (AST)	p. 285
20.3.1 Techniques of Production EST (AST)	p. 286
20.3.2 FMA and Corrective Action	p. 287
20.4 Production EST (AST) Studies at ATandT	p. 288
20.4.1 Facilities Hardware and Software	p. 289
20.4.2 Thermal Profile	p. 291
20.5 Results of the Thermal Cycling Studies	p. 291
20.5.1 Phase I Study	p. 292
20.5.2 Phase IIa	p. 292
20.5.3 Phase IIb	p. 294
20.5.4 Phase III	p. 294
20.5.5 Phase IV	p. 296
20.5.6 Future Studies	p. 296
20.5.7 Conclusion	p. 297
Acknowledgments	p. 297
References	p. 298
Chapter 21 Production Ast With Computer Disks	p. 300
21.1 Introduction	p. 300
21.2 Growing Reliability	p. 301
21.3 Problem	p. 302
21.4 Case Study	p. 302
21.5 Product Flow	p. 303
21.6 Profile Utilized	p. 304
21.7 A Look at the Failure Mechanisms	p. 304
21.8 The Bottom Line	p. 306
21.9 Conclusion	p. 307
References	p. 307
Chapter 22 Benchmarking	p. 308
22.1 Introduction to Benchmarking	p. 308
22.1.1 Traditional Benchmarking	p. 310
22.1.2 Product Benchmarking	p. 313
22.1.3 AST Benchmarking	p. 316
22.2 The AST Benchmarking Process	p. 317
22.3 Benchmarking Partnerships--Otis Elevator Company and United Technologies/3Com Corporation (U.S. Robotics)	p. 325
22.4 Benchmarking AST Survey Data	p. 327
22.5 Summary	p. 329
Acknowledgments	p. 329
References	p. 329
Appendix A Environmental Stress Screening Questionnaire--1997	p. 330
Appendix B Environmental Stress Screening Questionnaire--1996 and 1997 Results	p. 333
Glossary of Stress Testing Terminology	p. 338
Bibliography	p. 340
Index	p. 365
Epilogue	p. 369
About the Editors	p. 371

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