Cover image for Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy
Title:
Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy
Personal Author:
Kee, Hang Ching
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2003
Subject Term:
Intermetallic compounds

Alloys

Physical metallurgy
DSP_DISSERTATION:
Project Paper (Bachelor of Mechanical Engineering (Material)) - Universiti Teknologi Malaysia, 2003

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 30000010013058 TA489 K43 2003 Closed Access Thesis UTM Project Paper (Closed Access)
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