Title:
The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TS226 M63 2005 raf
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000001321 | CP 4467 | Computer File Accompanies UTM Thesis/Project Paper | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
Searching... | 30000010085836 | CP 4467 | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
