Title:
Electronics packaging forum
Publication Information:
New York : Van Nostrand Reinhold, <c1991- >
Physical Description:
2v.
ISBN:
9780442001780
9780442004767
General Note:
Based on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology.
Subject Term:
Added Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 30000001140957 | TK7870.15E53 1990 | Open Access Book | Book | Searching... |
Searching... | 30000001140916 | TK7870.15E53 1990 | Open Access Book | Book | Searching... |
