Title:
Electronics packaging forum : multichip module technology issues
Publication Information:
New York : IEEE, 1994
ISBN:
9780780304390
Added Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000005006147 | TK7870.15 E43 1994 | Open Access Book | Book | Searching... |