Title:
Effect of nickle doping in Sn-Ag-Cu solders on intermetallics formed during soldering on direct immersion gold (DIG) surface finish
Personal Author:
Publication Information:
2011
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TN760 N48 2011 raf
Supervisor : Prof. Dr. Ali Ourdjini
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2011
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | 774966-2002 | XX(774966.1) | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
Searching... | 30000010271085 | CP 055289 ra | UTM Special Collection - Computer File | Compact Disc Accompanies UTM Thesis/Project Paper | Searching... |
