Cover image for Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages
Title:
Interdiffusion of tin-rich and lead-rich composite solder during reflow process and ageing treatment on organic flip-chip packages
Personal Author:
Tan, Cheu Li
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2003
Subject Term:
Solder and soldering

Electronic packaging
DSP_DISSERTATION:
Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2003

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 30000010027629 TS196.4 T36 2003 Closed Access Thesis UTM Project Paper (Closed Access)
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