Cover image for Use of failure mode effect analysis (FMEA) to reduce defects in subassembly line of ink delivery system
Title:
Use of failure mode effect analysis (FMEA) to reduce defects in subassembly line of ink delivery system
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2006
Physical Description:
1 CD-ROM; 12cm.
General Note:
Also available in printed version : TS156.8 R46 2006 raf
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Industri)) - Universiti Teknologi Malaysia, 2006

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FKM30000002500 CP 012429 Computer File Accompanies UTM Thesis/Project Paper Compact Disc Accompanies UTM Thesis/Project Paper
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30000010087273 CP 012429 UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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