Title:
Quality improvement of the wire bonding process in a semi conductor company
Personal Author:
Publication Information:
2011
Physical Description:
xv, 101 p. : ill. ; 30 cm.
General Note:
Also available in CD-ROM : CP 055314 ra
Supervisor : Assoc. Prof. Dr. Wong Kuan Yew
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Industri)) - Universiti Teknologi Malaysia, 2011
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000006138 | XX(774080.1) | Closed Access Thesis | UTM Project Paper (Open Shelves) | Searching... |
Searching... | 30000010269489 | HD62.15 N49 2011 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
