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1. 
Cover image for Reliability and failure of electronic materials and devices
2. 
Cover image for Reliability Prediction from Burn-in Data Fit to Reliability Models
3. 
Cover image for Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
4. 
Cover image for Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
5. 
Cover image for Structural dynamics of electronic and photonic systems
6. 
Cover image for Dependability in electronic systems : mitigation of hardware failures, soft errors, and electro-magnetic disturbances
7. 
Cover image for Failure analysis : a practical guide for manufacturers of electronic components and systems
8. 
Cover image for Reliability technology : principles and practice of failure prevention in electronic systems
9. 
Cover image for Classical and damage mechanics-based models for lead-free solder interconnects
10. 
Cover image for Classical and damage mechanics-based models for lead-free solder interconnects
11. 
Cover image for Solder joint reliability prediction for multiple environments
12. 
Cover image for Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies