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1. 
Cover image for Heat transfer : thermal management of electronics
2. 
Cover image for Simulation of dynamic behaviour of chassis of a handheld electronics product under a free fall drop condition
3. 
Cover image for Simulation of dynamic behaviour of chassis of a handheld electronics product under a free fall drop condition
4. 
Cover image for Kawalan motor menggunakan labview
5. 
Cover image for Merekabentuk gasing pangkah menggunakan bahan getah
6. 
Cover image for Productivity improvement using IE work study tools in an electronics company
7. 
Cover image for MECHANICAL ANALYSIS OF ELECTRONIC PACKAGING SYSTEMS
8. 
Cover image for Surface mount technology for concurrent engineering and manufacturing