![Cover image for Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method Cover image for Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method](/client/assets/5.0.0/ctx//client/images/no_image.png)
Title:
Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method
Personal Author:
Publication Information:
2008
Physical Description:
xv, 73 p. : ill. ; 30 cm.
General Note:
Suupervisor : Dr. Nazri Kamsah
Also available in CD-ROM : CP 027013 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Automotif)) - Universiti Teknologi Malaysia, 2008
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | FKM30000005278 | TK7870.16 N67 2008 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | 30000010204012 | TK7870.16 N67 2008 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |