Title:
System-in-package RF design and applications
Personal Author:
Series:
Artech House microwave library
Publication Information:
Norwood, MA. : Artech House, 2007
ISBN:
9781580539050
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000010127410 | TK7874.78 G39 2007 | Open Access Book | Book | Searching... |
On Order
Summary
Summary
In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.
Table of Contents
Introduction |
LTCC versus Laminate |
Assembly Process |
TX and RX Architecture |
RF Components |
Filters |
Other Passive Circuits |
Active Circuit Design |
Oscillators and Synthesizers |
Advanced Packaging Techniques (Designs) |
Advanced RF Design Techniques |