Understanding smart sensors

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Title:

Personal Author:

Frank, Randy

Publication Information:

Boston, Mass. : Artech House, 1996

ISBN:

9780890068243

Subject Term:

Detectors -- Design and construction

Programmable controllers

Signal processing -- Digital techniques

Semiconductors

Available:*

Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... PSZ JB	30000004124123	TA165 F74 1996	Open Access Book	Book	Searching... Unknown

"Two of the most important trends in sensor development in recent years have been advances in micromachined sensing elements of all kinds, and the increase in intelligence applied at the sensor level. This book addresses both, and provides a good overview of current technology". -- I&CS

Author Notes

Randy Frank received his B.S. and M.S. in Electrical Engineering, as well as his M.B.A. in Management, from Wayne State University in Detroit, Michigan.

Frank is Technical Marketing Manager with ON Semiconductor in Phoenix, Arizona. He is a member of the Society of Automotive Engineers and former chairman of its Sensors Standards Committee, and a member of the IEEE and its Sensor Terminology Taskforce. Author of over 200 technical papers,

050

Preface	p. xv
Chapter 1 Smart Sensor Basics	p. 1
1.1 Introduction	p. 1
1.2 Mechanical-Electronic Transitions in Sensing	p. 3
1.3 Nature of Sensors	p. 4
1.4 Integration of Micromachining and Microelectronics	p. 9
1.5 Summary	p. 14
References	p. 14
Chapter 2 Micromachining	p. 15
2.1 Introduction	p. 15
2.2 Bulk Micromachining	p. 16
2.2.1 Silicon on Silicon Bonding	p. 19
2.2.2 Silicon on Glass (Anodic) Bonding	p. 20
2.3 Surface Micromachining	p. 20
2.3.1 Squeeze-Film Damping	p. 22
2.3.2 Stiction	p. 23
2.3.3 Particulate Control	p. 23
2.3.4 Combinations of Surface and Bulk Micromachining	p. 24
2.4 Other Micromachining Techniques	p. 25
2.4.1 LIGA Process	p. 25
2.4.2 Dry Etching Processes	p. 25
2.4.3 Silicon Fusion Bonding	p. 27
2.4.4 Lasers in Micromachining	p. 28
2.4.5 Post Etching to Obtain Smarter Structures	p. 29
2.5 Other Micromachined Materials	p. 33
2.5.1 Diamond as an Alternate Sensor Material	p. 33
2.5.2 Metal Oxides and Piezoelectric Sensing	p. 34
2.5.3 Films on Microstructures	p. 34
2.6 Summary	p. 35
References	p. 35
Chapter 3 The Nature of Semiconductor Sensor Output	p. 39
3.1 Introduction	p. 39
3.2 Sensor Output Characteristics	p. 39
3.2.1 Wheatstone Bridge	p. 40
3.2.2 Piezoresistivity in Silicon	p. 41
3.2.3 Semiconductor Sensor Definitions	p. 43
3.2.4 Static versus Dynamic Operation	p. 45
3.3 Other Sensing Technologies	p. 46
3.3.1 Capacitive Sensing	p. 46
3.3.2 Piezoelectric Sensing	p. 46
3.3.3 Hall Effect	p. 48
3.3.4 Chemical Sensors	p. 49
3.3.5 Improving Sensor Characteristics	p. 49
3.4 Digital Output Sensors	p. 50
3.4.1 Incremental Optical Encoders	p. 50
3.4.2 Digital Techniques	p. 51
3.5 Noise/Interference Aspects	p. 53
3.6 Low-Power, Low-Voltage Sensors	p. 53
3.6.1 Impedance	p. 54
3.7 An Analysis of Sensitivity Improvement	p. 54
3.7.1 Thin Diaphragm	p. 54
3.7.2 Increase Diaphragm Area	p. 54
3.7.3 Combined Solution: Micromachining and Microelectronics	p. 55
3.8 Summary	p. 55
References	p. 56
Chapter 4 Getting Sensor Information into the MCU	p. 57
4.1 Introduction	p. 57
4.2 Amplification and Signal Conditioning	p. 57
4.2.1 Instrumentation Amplifiers	p. 59
4.2.2 Sleep-Mode Operational Amplifier	p. 59
4.2.3 Rail-to-Rail Operational Amplifiers	p. 60
4.2.4 Switched-Capacitor Amplifier	p. 64
4.2.5 Barometer Application Circuit	p. 64
4.2.6 A 4- to 20-mA Signal Transmitter	p. 65
4.2.7 Schmitt Trigger	p. 65
4.3 Separate versus Integrated Signal Conditioning	p. 65
4.3.1 Integrated Passive Elements	p. 68
4.3.2 Integrated Active Elements	p. 68
4.4 Digital Conversion	p. 68
4.4.1 A/D Converters	p. 70
4.4.2 ADC Performance	p. 72
4.4.3 ADC Accuracy/Error Implications	p. 74
4.5 Summary	p. 74
References	p. 75
Chapter 5 Using MCUs/DSPs to Increase Sensor IQ	p. 77
5.1 Introduction	p. 77
5.1.1 Other IC Technologies	p. 77
5.1.2 Logic Requirements	p. 78
5.2 MCU Control	p. 79
5.3 MCUs for Sensor Interface	p. 79
5.3.1 Peripherals	p. 80
5.3.2 Memory	p. 80
5.3.3 I/O	p. 81
5.3.4 Onboard A/D Conversion	p. 81
5.3.5 Power-Saving Capability	p. 83
5.3.6 Local Voltage or Current Regulation	p. 84
5.3.7 Modular MCU Design	p. 85
5.4 DSP Control	p. 85
5.4.1 Algorithms versus Look-Up Tables	p. 88
5.5 Techniques and Systems Considerations	p. 88
5.5.1 Linearization	p. 89
5.5.2 PWM Control	p. 89
5.5.3 Autozero and Autorange	p. 90
5.5.4 Diagnostics	p. 93
5.5.5 EMC/RFI Reduction	p. 93
5.5.6 Indirect (Computed not Sensed) versus Direct Sensing	p. 93
5.6 Software, Tools, and Support	p. 94
5.7 Sensor Integration	p. 94
5.8 Summary	p. 96
References	p. 97
Chapter 6 Communications for Smart Sensors	p. 99
6.1 Introduction	p. 99
6.2 Background and Definitions	p. 99
6.2.1 Background	p. 101
6.3 Sources (Organizations) and Standards	p. 102
6.4 Automotive Protocols	p. 103
6.4.1 SAE J1850	p. 103
6.4.2 CAN Protocol	p. 105
6.4.3 Other Automotive Protocols	p. 108
6.5 Industrial Networks	p. 108
6.5.1 Industrial Usage of CAN	p. 109
6.5.2 LonTalk Protocol	p. 110
6.5.3 Other Industrial Protocols	p. 110
6.6 Office/Building Automation	p. 111
6.7 Home Automation	p. 111
6.7.1 CEBus	p. 112
6.7.2 LonTalk	p. 112
6.8 Protocols in Silicon	p. 113
6.8.1 MCU with Integrated SAE J1850	p. 113
6.8.2 MCU with Integrated CAN	p. 113
6.8.3 Neuron Chips and LonTalk Protocol	p. 118
6.8.4 MI-Bus	p. 119
6.8.5 Other MCUs and Protocols	p. 120
6.9 Other Aspects of Network Communications	p. 120
6.9.1 MCU Protocols	p. 121
6.9.2 Transition between Protocols	p. 121
6.9.3 The Protocol as a Module	p. 122
6.10 Summary	p. 123
References	p. 123
Chapter 7 Control Techniques	p. 125
7.1 Introduction	p. 125
7.1.1 Programmable Logic Controllers	p. 125
7.1.2 Open versus Closed-Loop Systems	p. 126
7.1.3 PID Control	p. 126
7.2 State Machines	p. 129
7.3 Fuzzy Logic	p. 129
7.4 Neural Networks	p. 133
7.4.1 Combined Fuzzy + Neural	p. 135
7.5 Adaptive Control	p. 136
7.6 Other Control Areas	p. 137
7.6.1 RISC versus CISC Architecture	p. 138
7.6.2 Combined CISC, RISC, and DSP	p. 140
7.7 Impact of Artificial Intelligence	p. 141
7.8 Summary	p. 142
References	p. 142
Chapter 8 Transceivers, Transponders, and Telemetry	p. 145
8.1 Introduction	p. 145
8.1.1 The RF Spectrum	p. 146
8.1.2 Spread Spectrum	p. 148
8.2 Wireless Data and Communications	p. 150
8.2.1 Wireless Local Area Networks	p. 151
8.2.2 Fax/Modems	p. 151
8.2.3 Wireless Zone Sensing	p. 152
8.2.4 Optical Signal Transmission	p. 153
8.3 RF Sensing	p. 153
8.3.1 SAW	p. 154
8.3.2 Radar	p. 155
8.3.3 Global Positioning System (GPS)	p. 156
8.3.4 Remote Emissions Sensing	p. 157
8.3.5 Remote Keyless Entry	p. 158
8.3.6 Intelligent Transportation System	p. 159
8.3.7 RF-ID	p. 161
8.3.8 Other Remote Sensing	p. 162
8.3.9 Measuring RF Signal Strength	p. 163
8.4 Telemetry	p. 163
8.5 Summary	p. 165
References	p. 166
Chapter 9 Microelectromechanical Systems (MEMS)	p. 169
9.1 Introduction	p. 169
9.2 Micromachined Actuators	p. 169
9.2.1 Microvalves	p. 170
9.2.2 Micromotors	p. 171
9.2.3 Micropumps	p. 173
9.2.4 Microdynamometer	p. 175
9.2.5 Actuators in Other Semiconductor Materials	p. 176
9.3 Other Micromachined Structures	p. 176
9.3.1 Cooling Channels	p. 176
9.3.2 Micro-Optics	p. 177
9.3.3 Microgripper	p. 178
9.3.4 Microprobes	p. 179
9.3.5 Micromirrors	p. 179
9.3.6 Heating Elements	p. 180
9.3.7 Thermionic Emitters	p. 180
9.3.8 Field Emission Devices	p. 181
9.3.9 Unfoldable Microelements	p. 182
9.3.10 Micronozzles	p. 184
9.3.11 Interconnects for Stacked Wafers	p. 184
9.4 Summary	p. 185
References	p. 185
Chapter 10 Packaging Implications of Smarter Sensors	p. 187
10.1 Introduction	p. 187
10.2 Semiconductor Packaging Applied to Sensors	p. 187
10.2.1 Increased Pin Count	p. 190
10.3 Hybrid Packaging	p. 191
10.3.1 Ceramic Packaging and Ceramic Substrates	p. 191
10.3.2 Multichip Modules	p. 191
10.3.3 Dual-Chip Packaging	p. 193
10.3.4 Ball Grid Array Packaging	p. 194
10.4 Packaging for Monolithic Sensors	p. 195
10.4.1 Plastic Packaging	p. 196
10.4.2 Surface-Mount Packaging	p. 196
10.4.3 Flip-Chip	p. 196
10.4.4 Wafer-Level Packaging	p. 198
10.5 Reliability Implications	p. 199
10.5.1 Wafer-Level Sensor Reliability	p. 202
10.6 Summary	p. 203
References	p. 203
Chapter 1 Mechatronics and Sensing Systems	p. 205
11.1 Introduction	p. 205
11.1.1 Integration and Mechatronics	p. 205
11.2 Smart-Power ICs	p. 206
11.3 Embedded Sensing	p. 208
11.3.1 Temperature Sensing	p. 208
11.3.2 Current Sensing in Power ICs	p. 211
11.3.3 Diagnostics	p. 211
11.4 Sensing Arrays	p. 215
11.4.1 Multiple Sensing Devices	p. 215
11.4.2 Multiple Types of Sensors	p. 218
11.4.3 An Integrated Sensing System	p. 218
11.5 Other System Aspects	p. 219
11.5.1 Batteries	p. 219
11.5.2 Field Emission Displays	p. 220
11.5.3 System Voltage Transients, ESD, and EMI	p. 220
11.6 Summary	p. 222
References	p. 222
Chapter 12 The Next Phase of Sensing Systems	p. 225
12.1 Introduction	p. 225
12.2 Future Semiconductor Capabilities	p. 225
12.3 Future System Requirements	p. 227
12.4 Not-So-Future Systems	p. 228
12.4.1 Fabry-Perot Interferometer	p. 228
12.4.2 HVAC Sensor Chip	p. 229
12.4.3 Speech Recognition and Micro-Microphones	p. 230
12.4.4 Microgyroscope	p. 231
12.4.5 MCU with Integrated Pressure Sensor	p. 231
12.5 Software, Sensing, and the System	p. 231
12.6 Alternate Views of Smart Sensing	p. 236
12.7 Summary	p. 236
References	p. 238
Smart Sensor Acronym Decoder and Glossary	p. 241
About the Author	p. 259
Index	p. 261

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