Cover image for Study of intermetallic compound formation during soldering on Cu-Ni Pd finish
Title:
Study of intermetallic compound formation during soldering on Cu-Ni Pd finish
Personal Author:
Publication Information:
2008
Physical Description:
xvii, 100p. : ill. ; 30cm. + 1 CD-ROM
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini

Also available in CD-ROM : CP 020408 ra
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DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

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30000010204049 TS610 A54 2008 raf Closed Access Thesis UTM Project Paper (Closed Access)
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