Cover image for Intermetallic compounds (IMC) formation during soldering
Title:
Intermetallic compounds (IMC) formation during soldering
Personal Author:
Publication Information:
2008
Physical Description:
xv, 90 p. : ill. ; 30 cm.
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini

Also available CD-ROM : CP 026988 ra
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

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FKM30000001905 TS610 Z87 2008 raf Closed Access Thesis UTM Project Paper (Closed Access)
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30000010204062 TS610 Z87 2008 raf Closed Access Thesis UTM Project Paper (Closed Access)
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