Title:
Study of dissolution nickel layer in enig surface finish during reflow soldering
Personal Author:
Publication Information:
2006
Physical Description:
xvii, 117 p. : ill. ; 30 cm. + 1 CD-ROM
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini
Also available in CD-ROM: CP 013620 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000001741 | TS610 W66 2006 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | 30000010097717 | TS610 W66 2006 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
