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Summary
Summary
Substrate noise coupling - the coupling of signals from one node to another through a substrate - is a frequent problem that occurs in integrated circuits. This book offers guidance on the impact of substrate noise on various circuits operating from baseband frequencies up to mm-wave frequencies.
Author Notes
Stephane Bronckers is currently an EMC specialist at Laborelec, which is part of the GDF Suez Group. Dr. Bronckers has been a research assistant in the Department of Fundamental Electricity and Instrumentation at the Vrije Universiteit Brussels (VUB) and has worked at the Interuniversity Microelectronics Center (IMEC). He received an M.Sc. and a Ph.D. from the VUB.
Geert Van der Plas is a principal scientist at the Interuniversity Microelectronics Center (IMEC) in Belgium. He received an M.Sc. and a Ph.D. from the Katholieke Universities Leuven, Belgium.
Gerd Vandersteen is a professor in the Department of Electrical Measurement (ELEC) at the Vrije Universities Brussels, where he received a Ph.D. in electrical engineering.
Yves Rolain is a professor in the Department of Electrical Measurement (ELEC) at the Vrije Universiteit Brussels, where he received an M.S. in computer sciences and a Ph.D. in applied sciences.
Table of Contents
Foreword | p. xiii |
Preface | p. xv |
Acknowledgments | p. xvii |
Chapter 1 Introduction | p. 1 |
1.1 Introduction and Motivation | p. 1 |
1.2 Book overview | p. 4 |
References | p. 5 |
Chapter 2 Substrate Noise Propagation | p. 7 |
2.1 Introduction | p. 7 |
2.2 Modeling the Substrate | p. 8 |
2.2.1 Analytical Resistance Calculation Between Two Contacts | p. 9 |
2.2.2 Finite Difference Method | p. 13 |
2.2.3 Finite Element Method | p. 17 |
2.3 The Substrate Modeled with FDM | p. 19 |
2.3.1 Experimental Description | p. 19 |
2.3.2 Analysis of the Substrate Noise Propagation | p. 20 |
2.3.3 Conclusions | p. 27 |
2.4 The Substrate as a Finite Element Model | p. 28 |
2.4.1 Simulation Methodology | p. 28 |
2.4.2 Dealing with N-Doped Regions | p. 30 |
2.4.3 Simulation Setup for the Test Structure | p. 33 |
2.4.4 Comparison | p. 33 |
2.4.5 Conclusions | p. 33 |
2.5 Conclusions | p. 34 |
References | p. 36 |
Chapter 3 Passive Isolation Structures | p. 39 |
3.1 Introduction | p. 39 |
3.2 Overview and Description of the Different Types of Passive Isolation Structures | p. 40 |
3.2.1 The Template Layout | p. 42 |
3.2.2 Integrating the Different Types of Guard Rings | p. 43 |
3.2.3 Simulation Setup | p. 44 |
3.3 Prediction and Understanding of Guard Rings | p. 44 |
3.3.1 Reference Structure | p. 45 |
3.3.2 P-Well Block Isolation | p. 47 |
3.3.3 N-Well Isolation | p. 50 |
3.3.4 P + Guard Ring Shielding | p. 52 |
3.3.5 Triple Well Shielding | p. 56 |
3.3.6 Comparison and Conclusion | p. 60 |
3.4 Design of an Efficient P + Guard Ring | p. 65 |
3.4.1 Impedance of the Ground Interconnect | p. 65 |
3.4.2 Width of the P + Guard Ring | p. 67 |
3.4.3 Distance to the Victim | p. 70 |
3.4.4 Guidelines for Good P + Guard Ring Design | p. 75 |
3.5 Conclusions | p. 76 |
References | p. 77 |
Chapter 4 Noise Coupling in Active Devices | p. 79 |
4.1 Introduction | p. 79 |
4.2 Substrate Noise Impact on Analog Design | p. 80 |
4.3 Impact Simulation Methodology | p. 82 |
4.3.1 EM Simulation | p. 83 |
4.3.2 Circuit Simulation | p. 86 |
4.4 Transistor Test Bench | p. 86 |
4.4.1 Description of the Transistor Under Test | p. 87 |
4.4.2 Modeling the Transistor Test Bench | p. 87 |
4.4.3 Experimental Validation | p. 92 |
4.5 Substrate Noise Coupling Mechanisms in a Transistor | p. 92 |
4.5.1 Analyzing the Different Coupling Mechanisms in a Transistor | p. 94 |
4.5.2 Description and Measurement of the Device Under Test | p. 97 |
4.5.3 Modeling Different Substrate Noise Coupling Mechanisms | p. 100 |
4.5.4 Quantifying the Different Substrate Noise Coupling Mechanisms | p. 104 |
4.5.5 Experimental Validation of the Substrate Noise Coupling Mechanisms | p. 106 |
4.6 Conclusions | p. 108 |
References | p. 109 |
Chapter 5 Measuring the Coupling Mechanisms in Analog/RF Circuits | p. 111 |
5.1 Introduction | p. 111 |
5.2 Measurement-Based Identification of the Dominant Substrate Noise Coupling Mechanisms | p. 114 |
5.2.1 Measurement of the Different Spurs | p. 115 |
5.2.2 Sensitivity Functions | p. 116 |
5.2.3 Determining the Influence of the PCB | p. 118 |
5.3 Example: 900 MHz LC-VCO | p. 119 |
5.3.1 Description of the LC-VCO | p. 119 |
5.3.2 Substrate Sensitivity Measurements | p. 120 |
5.3.3 Revealing the Dominant Coupling Mechanism for FM Spurs | p. 123 |
5.3.4 Revealing the Dominant Coupling Mechanism for AM Spurs | p. 128 |
5.3.5 Influence of the PCB Decoupling Capacitors on the Substrate Noise Impact | p. 130 |
5.3.6 Conclusions | p. 132 |
5.4 Study of the Coupling Mechanisms Between a Power Amplifier and an LC-VCO | p. 133 |
5.4.1 Description of the Design of the PPA and the LC-VCO | p. 135 |
5.4.2 Coupling Mechanisms Between the PPA and the LC-VCO | p. 137 |
5.4.3 Measuring the Dominant Coupling Mechanisms | p. 142 |
5.4.4 Conclusions | p. 146 |
5.5 Conclusions | p. 148 |
References | p. 148 |
Chapter 6 The Prediction of the Impact of Substrate Noise on Analog/RF Circuits | p. 151 |
6.1 Introduction | p. 151 |
6.2 The Substrate Modeled with FDM | p. 152 |
6.2.1 Impact Simulation Methodology | p. 152 |
6.2.2 Prediction of the Impact of Substrate Noise from DC Up to LO Frequency | p. 156 |
6.2.3 Experimental Validation of the Simulation Methodology | p. 160 |
6.2.4 Conclusions | p. 162 |
6.3 Substrate Modeled by the FEM Method | p. 163 |
6.3.1 Impact Simulation Methodology | p. 163 |
6.3.2 Prediction of the Impact of Substrate Noise | p. 166 |
6.3.3 Verification with Measurements | p. 170 |
6.3.4 Conclusions | p. 172 |
6.4 Techniques to Reduce Substrate Noise Coupling | p. 173 |
6.4.1 Layout Techniques to Reduce the Substrate Noise Coupling | p. 174 |
6.4.2 Circuit Techniques to Reduce the Substrate Noise Coupling | p. 175 |
6.4.3 3D Stacking as a Solution to Substrate Noise Issues | p. 179 |
6.4.4 Separated Analog/Digital Ground | p. 185 |
6.4.5 Shared Analog/Digital Ground | p. 186 |
6.4.6 Experimental Validation | p. 186 |
6.4.7 Conclusions | p. 190 |
6.5 Conclusions | p. 191 |
References | p. 192 |
Chapter 7 Noise Coupling in Analog/RF Systems | p. 195 |
7.1 Introduction | p. 195 |
7.2 Impact Simulation Methodology | p. 196 |
7.2.1 EM Simulation | p. 198 |
7.2.2 Parasitic Extraction | p. 200 |
7.2.3 Circuit Simulation | p. 200 |
7.3 Analyzing the Impact of Substrate Noise in Analog/RF Systems | p. 201 |
7.3.1 Analysis of the Propagation of Substrate Noise | p. 202 |
7.3.2 Analyzing the Substrate Noise Coupling | p. 202 |
7.4 Substrate Noise Impact on a 48-53 GHz LC-VCO | p. 203 |
7.4.1 Description of the LC-VCO | p. 203 |
7.4.2 Simulation Setup | p. 203 |
7.4.3 Conclusion | p. 207 |
7.5 Impact of Substrate Noise on a DC to 5 GHz Wideband Receiver | p. 208 |
7.5.1 Description of the Wideband Receiver | p. 208 |
7.5.2 Simulation Setup | p. 211 |
7.5.3 Parasitic Extraction | p. 214 |
7.5.4 Circuit Simulation | p. 214 |
7.5.5 Revealing the Dominant Coupling Mechanism | p. 215 |
7.5.6 Experimental Verification | p. 220 |
7.6 Conclusions and Discussion | p. 222 |
7.6.1 Conclusions | p. 222 |
7.6.2 Discussion | p. 223 |
References | p. 224 |
Appendix A Narrowband Frequency Modulation of LC-Tank VCOs | p. 227 |
Appendix B Port Conditions | p. 231 |
List of Acronyms | p. 233 |
About the Authors | p. 237 |
Index | p. 239 |