Cover image for Substrate noise coupling in analog/RF circuits
Title:
Substrate noise coupling in analog/RF circuits
Publication Information:
Norwood, MA : Artech House, 2010
Physical Description:
xvii, 241 p., [8] p. of plates : ill. (some col.) ; 24 cm.
ISBN:
9781596932715
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30000010235917 TK7874.78 S83 2010 Open Access Book Book
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30000010251062 TK7874.78 S83 2010 Open Access Book Book
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Summary

Summary

Substrate noise coupling - the coupling of signals from one node to another through a substrate - is a frequent problem that occurs in integrated circuits. This book offers guidance on the impact of substrate noise on various circuits operating from baseband frequencies up to mm-wave frequencies.


Author Notes

Stephane Bronckers is currently an EMC specialist at Laborelec, which is part of the GDF Suez Group. Dr. Bronckers has been a research assistant in the Department of Fundamental Electricity and Instrumentation at the Vrije Universiteit Brussels (VUB) and has worked at the Interuniversity Microelectronics Center (IMEC). He received an M.Sc. and a Ph.D. from the VUB.
Geert Van der Plas is a principal scientist at the Interuniversity Microelectronics Center (IMEC) in Belgium. He received an M.Sc. and a Ph.D. from the Katholieke Universities Leuven, Belgium.
Gerd Vandersteen is a professor in the Department of Electrical Measurement (ELEC) at the Vrije Universities Brussels, where he received a Ph.D. in electrical engineering.
Yves Rolain is a professor in the Department of Electrical Measurement (ELEC) at the Vrije Universiteit Brussels, where he received an M.S. in computer sciences and a Ph.D. in applied sciences.


Table of Contents

Forewordp. xiii
Prefacep. xv
Acknowledgmentsp. xvii
Chapter 1 Introductionp. 1
1.1 Introduction and Motivationp. 1
1.2 Book overviewp. 4
Referencesp. 5
Chapter 2 Substrate Noise Propagationp. 7
2.1 Introductionp. 7
2.2 Modeling the Substratep. 8
2.2.1 Analytical Resistance Calculation Between Two Contactsp. 9
2.2.2 Finite Difference Methodp. 13
2.2.3 Finite Element Methodp. 17
2.3 The Substrate Modeled with FDMp. 19
2.3.1 Experimental Descriptionp. 19
2.3.2 Analysis of the Substrate Noise Propagationp. 20
2.3.3 Conclusionsp. 27
2.4 The Substrate as a Finite Element Modelp. 28
2.4.1 Simulation Methodologyp. 28
2.4.2 Dealing with N-Doped Regionsp. 30
2.4.3 Simulation Setup for the Test Structurep. 33
2.4.4 Comparisonp. 33
2.4.5 Conclusionsp. 33
2.5 Conclusionsp. 34
Referencesp. 36
Chapter 3 Passive Isolation Structuresp. 39
3.1 Introductionp. 39
3.2 Overview and Description of the Different Types of Passive Isolation Structuresp. 40
3.2.1 The Template Layoutp. 42
3.2.2 Integrating the Different Types of Guard Ringsp. 43
3.2.3 Simulation Setupp. 44
3.3 Prediction and Understanding of Guard Ringsp. 44
3.3.1 Reference Structurep. 45
3.3.2 P-Well Block Isolationp. 47
3.3.3 N-Well Isolationp. 50
3.3.4 P + Guard Ring Shieldingp. 52
3.3.5 Triple Well Shieldingp. 56
3.3.6 Comparison and Conclusionp. 60
3.4 Design of an Efficient P + Guard Ringp. 65
3.4.1 Impedance of the Ground Interconnectp. 65
3.4.2 Width of the P + Guard Ringp. 67
3.4.3 Distance to the Victimp. 70
3.4.4 Guidelines for Good P + Guard Ring Designp. 75
3.5 Conclusionsp. 76
Referencesp. 77
Chapter 4 Noise Coupling in Active Devicesp. 79
4.1 Introductionp. 79
4.2 Substrate Noise Impact on Analog Designp. 80
4.3 Impact Simulation Methodologyp. 82
4.3.1 EM Simulationp. 83
4.3.2 Circuit Simulationp. 86
4.4 Transistor Test Benchp. 86
4.4.1 Description of the Transistor Under Testp. 87
4.4.2 Modeling the Transistor Test Benchp. 87
4.4.3 Experimental Validationp. 92
4.5 Substrate Noise Coupling Mechanisms in a Transistorp. 92
4.5.1 Analyzing the Different Coupling Mechanisms in a Transistorp. 94
4.5.2 Description and Measurement of the Device Under Testp. 97
4.5.3 Modeling Different Substrate Noise Coupling Mechanismsp. 100
4.5.4 Quantifying the Different Substrate Noise Coupling Mechanismsp. 104
4.5.5 Experimental Validation of the Substrate Noise Coupling Mechanismsp. 106
4.6 Conclusionsp. 108
Referencesp. 109
Chapter 5 Measuring the Coupling Mechanisms in Analog/RF Circuitsp. 111
5.1 Introductionp. 111
5.2 Measurement-Based Identification of the Dominant Substrate Noise Coupling Mechanismsp. 114
5.2.1 Measurement of the Different Spursp. 115
5.2.2 Sensitivity Functionsp. 116
5.2.3 Determining the Influence of the PCBp. 118
5.3 Example: 900 MHz LC-VCOp. 119
5.3.1 Description of the LC-VCOp. 119
5.3.2 Substrate Sensitivity Measurementsp. 120
5.3.3 Revealing the Dominant Coupling Mechanism for FM Spursp. 123
5.3.4 Revealing the Dominant Coupling Mechanism for AM Spursp. 128
5.3.5 Influence of the PCB Decoupling Capacitors on the Substrate Noise Impactp. 130
5.3.6 Conclusionsp. 132
5.4 Study of the Coupling Mechanisms Between a Power Amplifier and an LC-VCOp. 133
5.4.1 Description of the Design of the PPA and the LC-VCOp. 135
5.4.2 Coupling Mechanisms Between the PPA and the LC-VCOp. 137
5.4.3 Measuring the Dominant Coupling Mechanismsp. 142
5.4.4 Conclusionsp. 146
5.5 Conclusionsp. 148
Referencesp. 148
Chapter 6 The Prediction of the Impact of Substrate Noise on Analog/RF Circuitsp. 151
6.1 Introductionp. 151
6.2 The Substrate Modeled with FDMp. 152
6.2.1 Impact Simulation Methodologyp. 152
6.2.2 Prediction of the Impact of Substrate Noise from DC Up to LO Frequencyp. 156
6.2.3 Experimental Validation of the Simulation Methodologyp. 160
6.2.4 Conclusionsp. 162
6.3 Substrate Modeled by the FEM Methodp. 163
6.3.1 Impact Simulation Methodologyp. 163
6.3.2 Prediction of the Impact of Substrate Noisep. 166
6.3.3 Verification with Measurementsp. 170
6.3.4 Conclusionsp. 172
6.4 Techniques to Reduce Substrate Noise Couplingp. 173
6.4.1 Layout Techniques to Reduce the Substrate Noise Couplingp. 174
6.4.2 Circuit Techniques to Reduce the Substrate Noise Couplingp. 175
6.4.3 3D Stacking as a Solution to Substrate Noise Issuesp. 179
6.4.4 Separated Analog/Digital Groundp. 185
6.4.5 Shared Analog/Digital Groundp. 186
6.4.6 Experimental Validationp. 186
6.4.7 Conclusionsp. 190
6.5 Conclusionsp. 191
Referencesp. 192
Chapter 7 Noise Coupling in Analog/RF Systemsp. 195
7.1 Introductionp. 195
7.2 Impact Simulation Methodologyp. 196
7.2.1 EM Simulationp. 198
7.2.2 Parasitic Extractionp. 200
7.2.3 Circuit Simulationp. 200
7.3 Analyzing the Impact of Substrate Noise in Analog/RF Systemsp. 201
7.3.1 Analysis of the Propagation of Substrate Noisep. 202
7.3.2 Analyzing the Substrate Noise Couplingp. 202
7.4 Substrate Noise Impact on a 48-53 GHz LC-VCOp. 203
7.4.1 Description of the LC-VCOp. 203
7.4.2 Simulation Setupp. 203
7.4.3 Conclusionp. 207
7.5 Impact of Substrate Noise on a DC to 5 GHz Wideband Receiverp. 208
7.5.1 Description of the Wideband Receiverp. 208
7.5.2 Simulation Setupp. 211
7.5.3 Parasitic Extractionp. 214
7.5.4 Circuit Simulationp. 214
7.5.5 Revealing the Dominant Coupling Mechanismp. 215
7.5.6 Experimental Verificationp. 220
7.6 Conclusions and Discussionp. 222
7.6.1 Conclusionsp. 222
7.6.2 Discussionp. 223
Referencesp. 224
Appendix A Narrowband Frequency Modulation of LC-Tank VCOsp. 227
Appendix B Port Conditionsp. 231
List of Acronymsp. 233
About the Authorsp. 237
Indexp. 239