Cover image for Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni  - Au surface finishes
Title:
Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes
Personal Author:
Publication Information:
2007
Physical Description:
xvii, 108 p. : ill. ; 30 cm.
General Note:
Supervisor : Assoc. Prof. Dr. Ali Ourdjini

Also available in CD-ROM : CP 020070 ra
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

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263683-2002 TN690 A95 2007 raf Closed Access Thesis UTM Project Paper (Closed Access)
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30000010171505 TN690 A95 2007 raf Closed Access Thesis UTM Project Paper (Closed Access)
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