Title:
The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
Physical Description:
1v + 1 CD-ROM
General Note:
Also available in compact disc version : CP 4467 ra
Electronic Access:
Full text
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2005
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000001817 | TS226 M63 2005 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | FKM30000001819 | TS226 M63 2005 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
Searching... | 30000010085834 | TS226 M63 2005 | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
