Cover image for Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
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Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
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Journal of Phase Equilibria, Vol. 20(3) : 199-206. 1999
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30000010238142 MAK 17717 Open Access Book ILL Article
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