Design and modeling for 3D ICs and interposers

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Title:

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Series:

WSPC series in advanced integration and packaging ; v. 2

Publication Information:

Singapore : World Scientific, 2014

Physical Description:

xxi, 354 pages : illustrations (some color) ; 24 cm.

ISBN:

9789814508599

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Library	Item Barcode	Call Number	Material Type	Item Category 1	Status
Searching... PSZ JB	30000010335051	TK7874.893 S93 2014	Open Access Book	Book	Searching... Unknown