Cover image for Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes
Title:
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes
Personal Author:
Series:
Research Monograph (Universiti Teknologi Malaysia. Research Management Centre)
Physical Description:
xiv, 174 pages : illustrations ; 29 cm.
ISBN:
9789673537877
Subject Term:

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30000010319530 TK7870.15 A456 2011 af Non Circulating UTM Special Collection Materials Research Report (Closed Access)
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