Cover image for Effect of flux type on intermetallics formation in solder joint
Title:
Effect of flux type on intermetallics formation in solder joint
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
Physical Description:
1 CD-ROM; 12cm.
General Note:
Also available in printed version : TS226 C43 2005 raf
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005

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FKM30000001304 CP 8558 Computer File Accompanies UTM Thesis/Project Paper Compact Disc Accompanies UTM Thesis/Project Paper
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30000010094547 CP 8558 UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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