Title:
Effect of Ni-doping on intermetallics between Sn-3Ag-0.5Cu solders with electroless nickel/immersion gold(ENIG) surface finish
Personal Author:
Publication Information:
2012
Physical Description:
xv, 93 p. : ill. ; 30 cm.
General Note:
Also available in CD ROM : CP 055290 ra
Supervisor : Prof. Dr. Ali Ourdjini
Subject Term:
Added Author:
Added Corporate Author:
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteran (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2012
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
|---|---|---|---|---|---|
Searching... | FKM30000006730 | XX(792004.1) | Closed Access Thesis | UTM Project Paper (Open Shelves) | Searching... |
Searching... | 30000010294689 | TK7871.85 S58 2012 raf | Closed Access Thesis | UTM Project Paper (Closed Access) | Searching... |
