Title:
Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes
Personal Author:
Series:
Research Monograph (Universiti Teknologi Malaysia. Research Management Centre)
Publication Information:
2007
Physical Description:
xiv, 174 p. : ill. ; 30 cm.
Subject Term:
Added Corporate Author:
Available:*
Library | Item Barcode | Call Number | Material Type | Item Category 1 | Status |
---|---|---|---|---|---|
Searching... | 30000010267533 | TT267 A45 2007 af | Non Circulating UTM Special Collection Materials | Research Report (Closed Access) | Searching... |
Searching... | 30000010267534 | TT267 A45 2007 af | Open Access Book | UTM Special Collection (Open Shelves) | Searching... |
Searching... | 30000010267535 | TT267 A45 2007 af | Open Access Book | UTM Special Collection (Open Shelves) | Searching... |