Cover image for Characteristics of stress and strain field in organic substrate of a flip chip
Title:
Characteristics of stress and strain field in organic substrate of a flip chip
Personal Author:
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2005
General Note:
Also available in printed version : TK7874 C46 2005 raf
DSP_DISSERTATION:
Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2005

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FKM30000004719 CP 8307 UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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30000010092080 CP 8307 UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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