Cover image for Simulation of dynamic behaviour of chassis of a handheld electronics product under a free fall drop condition
Title:
Simulation of dynamic behaviour of chassis of a handheld electronics product under a free fall drop condition
Personal Author:
Chai, Ai Bao
Publication Information:
Skudai : Universiti Teknologi Malaysia, 2007
Physical Description:
1 CD-ROM ; 12 cm.
General Note:
Also available in printed version : TS175.5 C43 2007 raf
Subject Term:
Commercial products -- Testing

Electronic packaging

Mechanical engineering
Added Corporate Author:
Fakulti Kejuruteraan Mekanikal
DSP_DISSERTATION:
Project Paper (Sarjana Muda Kejuruteraan Mekanikal) - Universiti Teknologi Malaysia, 2007

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 30000010176591 CP 020214 ra UTM Special Collection - Computer File Compact Disc Accompanies UTM Thesis/Project Paper
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